NTMS5835NLR2G ON Semiconductor, NTMS5835NLR2G Datasheet

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NTMS5835NLR2G

Manufacturer Part Number
NTMS5835NLR2G
Description
MOSFET N-CH 50V 200MA 8SOIC
Manufacturer
ON Semiconductor
Series
-r
Datasheet

Specifications of NTMS5835NLR2G

Input Capacitance (ciss) @ Vds
2115pF @ 20V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
10 mOhm @ 10A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
9.2A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Power - Max
1.5W
Mounting Type
*
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NTMS5835NLR2G
Quantity:
7 600
NTMS5835NL
Power MOSFET
40 V, 12 A, 10 mW
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad
2. Surface−mounted on FR4 board using 0.155 in sq (100mm
© Semiconductor Components Industries, LLC, 2011
April, 2011 − Rev. 1
MAXIMUM RATINGS
THERMAL RESISTANCE MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Pulsed Drain
Current
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (V
L = 0.1 mH)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Ambient Steady State (Note 1)
Junction−to−Ambient − t ≤10 s (Note 1)
Junction−to−Foot (Drain) (Note 1)
Junction−to−Ambient Steady State (Note 2)
Compliant
Low R
Low Capacitance
Optimized Gate Charge
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(Cu area = 1.127 in sq [2 oz] including traces).
qJA
qJA
(Note 1)
(Note 1)
DS(on)
qJA
qJA
DD
= 40 V, V
Parameter
Parameter
GS
Steady
t ≤10 s
State
(T
= 10 V,
J
= 25°C unless otherwise stated)
t
p
= 10 ms
T
T
T
T
T
T
T
T
A
A
A
A
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
= 25°C
= 70°C
= 25°C
= 70°C
Symbol
T
Symbol
J
R
R
R
R
V
EAS
V
, T
IAS
I
P
P
qJA
qJA
qJF
qJA
DSS
DM
T
I
I
I
GS
D
D
S
D
D
L
STG
Value
2
−55 to
Value
121
+150
) pad size.
82
49
21
±20
260
9.2
7.4
1.5
1.0
9.6
2.6
1.6
40
12
48
20
69
37
1
°C/W
Unit
Unit
mJ
°C
°C
W
W
V
V
A
A
A
A
A
†For information on tape and reel specifications,
NTMS5835NLR2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
CASE 751
STYLE 12
8
(BR)DSS
40 V
(Note: Microdot may be in either location)
SO−8
Device
ORDERING INFORMATION
1
A
Y
WW
G
G
N−CHANNEL MOSFET
http://onsemi.com
14 mW @ 4.5 V
10 mW @ 10 V
R
= Assembly Location
= Year
= Work Week
= Pb−Free Package
DS(ON)
Source
Source
Source
(Pb−Free)
Package
MARKING DIAGRAM/
Gate
D
SO−8
PIN ASSIGNMENT
Publication Order Number:
MAX
S
1
Top View
2500/Tape & Reel
NTMS5835NL/D
Shipping
I
D
8
12 A
MAX
Drain
Drain
Drain
Drain

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NTMS5835NLR2G Summary of contents

Page 1

... IAS 260 °C L (Note: Microdot may be in either location) Symbol Value Unit NTMS5835NLR2G R 82 qJA R 49 qJA †For information on tape and reel specifications, °C/W including part orientation and tape sizes, please R 21 qJF refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES, CAPACITANCES & ...

Page 3

V 4.5 V 5 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.025 0.015 0.005 GATE−TO−SOURCE ...

Page 4

C iss 2000 1500 1000 C 500 oss C rss DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 4.5 ...

Page 5

TYPICAL PERFORMANCE CURVES 100 D = 0.5 0.2 0.1 10 0.05 0.02 1 0.01 0.1 SINGLE PULSE 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 t, PULSE TIME (s) Figure 13. Thermal Response http://onsemi.com 100 1000 ...

Page 6

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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