FP1109-R27-R Cooper/Bussmann, FP1109-R27-R Datasheet
FP1109-R27-R
Manufacturer Part Number
FP1109-R27-R
Description
Power Inductors 270nH 51A
Manufacturer
Cooper/Bussmann
Series
Flat-Pac FP1109r
Datasheet
1.FP1109-R47-R.pdf
(4 pages)
Specifications of FP1109-R27-R
Product
Inductors
Test Frequency
100 KHz
Inductance
270 nH
Tolerance
10 %
Maximum Dc Current
51 Amps
Maximum Dc Resistance
0.467 mOhms
Dimensions
11.2 mm W x 11.2 mm L x 9 mm H
Operating Temperature Range
- 40 C to + 125 C
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FP1109-R27-R
Manufacturer:
COOPER
Quantity:
1 280
Part Number:
FP1109-R27-R
Manufacturer:
COOPER
Quantity:
20 000
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1109 Series
Description:
• Halogen free
• 125°C maximum total temperature operation
• 11.2 x 11.2 x 9.0mm surface mount package
• Ferrite core material
• High current carrying capacity, low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 205nH to 950nH
• Current range from 11.5 to 69 amps
• Frequency range up to 2MHz
• RoHS compliant
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat 1
3 I rms : DC current for an approximate temperature rise of 40°C without core loss. Derating is
1108
Part Number
FP1109-R20-R
FP1109-R23-R
FP1109-R27-R
FP1109-R33-R
FP1109-R47-R
FP1109-R58-R
FP1109-1R0-R
SMD Device
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
BU-SB08800
7
OCL
1
± 10% (nH) FLL
205
247
270
311
463
548
950
2
Min. (nH)
122
147
160
185
275
325
565
I rms
Product Specifications
3
35
(Amps) I sat 1
4 I sat 1: Peak current for approximately 30% rolloff at +25°C.
5 I sat 2: Peak current for approximately 30% rolloff at +125°C.
6 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI * 10 -3 , B p-p : (Gauss),
7 Part Number Definition: FP1109-xxx-R
4
@ 25°C (Amps) I sat 2
Applications:
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
• Solder reflow temperature: J-STD-020D compliant
Packaging:
• Supplied in tape and reel packaging, 350 parts per reel,
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
• FP1109 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
• “-R” suffix = RoHS compliant
third character = # of zeros
22.5
11.5
(Range is application specific)
13” diameter reel
Page 1 of 4
69
55
51
44
27
5
@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor
Data Sheet: 4350
8.5
52
41
38
33
20
17
0.42 ±10%
233
233
233
233
233
233
233
6
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FP1109-R27-R Summary of contents
Page 1
... Frequency range up to 2MHz • RoHS compliant Part Number 7 OCL 1 ± 10% (nH) FLL FP1109-R20-R 205 FP1109-R23-R 247 FP1109-R27-R 270 FP1109-R33-R 311 FP1109-R47-R 463 FP1109-R58-R 548 FP1109-1R0-R 950 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms , 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms , I sat rms : DC current for an approximate temperature rise of 40° ...
Page 2
... F ront V iew 9 4.10 ref 2.03 ref (2X ) xxx = Inductance value in μ Decimal point “R” is present, then last character zeros Part Marking: FP1109 Packaging Information - mm 1.5 dia. +0.1/-0.0 Section A-A 17.5 11.4 9.3 Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel. ...
Page 3
Core Loss Inductance Characteristics 120% 100% 80% 60% 40% 20 ...
Page 4
Solder Reflow Profile T P Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C Preheat A T smax T smin t s 25°C Time 25°C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak ...