125800D00000G Aavid Thermalloy, 125800D00000G Datasheet - Page 9
![no-image](/images/no-image-200.jpg)
125800D00000G
Manufacturer Part Number
125800D00000G
Description
SOLDER ANCHOR FOR BGA HEATSINKS
Manufacturer
Aavid Thermalloy
Datasheet
1.125700D00000G.pdf
(116 pages)
Specifications of 125800D00000G
Accessory Type
Solder Anchor (2 required)
Packages Cooled
BGA
Length
7.62mm
Rohs Compliant
Yes
For Use With/related Products
Heat Sinks
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
43409
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The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
P D = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣR θ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (R θSA ),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
FIGURE 1
Where:
T J = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
T C = case temperature of the semiconductor device in °C.
T S = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
T A = ambient air temperature in °C.
How to select a heat sink
P D =
R θJC = thermal resistance from junction to case of the semiconductor device in °C per watt
R θCS = thermal resistance through the interface between the semiconductor device
R θSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
P D =
Semiconductor case
www.aavidthermalloy.com
R θJC + R θCS + R θSA
(cooler/dissipator)
Mounting surface
(usually stated by manufacturer of semiconductor device).
(heat source)
and the surface on which it is mounted in °C per watt.
Δ T
ΣR θ
Junction
Interface
T J –T A
P
R
D
θJC
R
θCS
T
J
T
C
T
S
surface to ambient, equation (3)
AMERICA
to ambient, equation (1)
Heat flow path junction
to ambient equation (2)
EUROPE
Heat flow path mounting
Heat flow path case
R
θSA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
USA Tel: +1 (603) 224-9988 email: info@aavid.com
P D =
P
D
Atmosphere
R θCS + R θSA
or ambient
T
T
T C –T A
A
A
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
FIGURE 2
T J
R θJC
ASIA
P D =
How To Select a Heat Sink
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
T S –T A
T C
R θSA
R θCS
T S
R θSA
T A
9
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