579302B00000G Aavid Thermalloy, 579302B00000G Datasheet - Page 114
![HEATSINK TO-220 SNAP-DOWN .75"](/photos/5/88/58833/579302b00000_sml.jpg)
579302B00000G
Manufacturer Part Number
579302B00000G
Description
HEATSINK TO-220 SNAP-DOWN .75"
Manufacturer
Aavid Thermalloy
Datasheet
1.T405R..pdf
(116 pages)
Specifications of 579302B00000G
Package Cooled
TO-220
Attachment Method
Clip
Outline
24.89mm x 19.05mm
Height
0.440" (11.18mm)
Power Dissipation @ Temperature Rise
3W @ 50°C
Thermal Resistance @ Forced Air Flow
6°C/W @ 500 LFM
Thermal Resistance @ Natural
16.8°C/W
Product
Heatsinks
Fin Style
Two Side Fins
Thermal Resistance
16.8 C / W
Dimensions
19.05 mm L x 24.89 mm W x 11.18 mm H
Designed For
TO-220
Color
Black
Packages Cooled
TO-220
External Width - Metric
24.89mm
External Height - Metric
11.18mm
External Length - Metric
19.05mm
Width
24.89mm
Length
19.05mm
Rohs Compliant
Yes
External Width - Imperial
0.98"
External Height - Imperial
0.44"
External Length - Imperial
0.75"
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
002636
579302B00000
HS220
579302B00000
HS220
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
579302B00000G
Manufacturer:
ATH
Quantity:
33 546
114
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
Ther-O-Bond
Ther-O-Bond
Ther-O-Bond
ORDERING INFORMATION
Part number
159900F00000G
161000F00000G
164000F00000G
200000F00000G
Ther-O-Bond
for high performance, production potting and encapsulating appli-
cations where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release. Ther-O-Bond
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
HANDLING CHARACTERISTICS
Mix ratio by weight,
resin to hardener:
Mixed viscosity @ 25°C, cps:
Work-life @ 25°C
Gel time @ 25°C
Cure schedule @ 25°C
Cure schedule @ 65°C
Cure schedule @ 100°C
PHYSICAL PROPERTIES
Color
Specific gravity
Operating temp, °C
Heat distortion temp, °C
Hardness, shore D:
Thermal
conductivity W/(m°C)
Compressive strength, psi
Dissipation factor,
Self extinguishing:
C.T.E. (ppm/°C)
Tensile strength (@25°C)
Dielectric
Shelf life
Ther-O-Bond
at room temperature, while providing a repairable,
thermally conductive bond.
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
www.aavidthermalloy.com
Grease & Epoxy
TM
TM
1500 is a versatile epoxy casting system developed
2000 acrylic adhesive cures rapidly
TM
Description
Ther-O-Bond
Ther-O-Bond
Ther-O-Bond
Ther-O-Bond
TM
TM
Adhesive
1500
2000
TM
TM
TM
TM
1500
1600
1600
2000
Black
1.5
-60 to 155
100
88
1.26
14,000
0.01
yes
25
9200 psi
800
18 months*
100 to 15
1000 - 1500
45 Minutes
3-6 Hours
8 Hours
1 Hour
0.5 Hour
AMERICA
EUROPE
Resin and hardener
Adhesive syringe
2-Part plastic kit
2-Part plastic kit
Activator bottle
Package/Kit
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
USA Tel: +1 (603) 224-9988 email: info@aavid.com
0.946 liter (1 qt)
10gm (0.35 oz)
40gm (1.40 oz)
TM
1500
25ml
13ml
Size
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
PRODUCT INFORMATION
Color
Thermal
conductivity W/(m-°C)
C.T.E. (ppm/°C)
Tensile strength (@25°C)
Dielectric strength (volts/mil)
Shelf life
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
Ther-O-Bond
For smaller applications, Ther-O-Bond
durable, high-impact bond, with good heat transfer characteris-
tics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards. This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bond
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
HANDLING CHARACTERISTICS
PHYSICAL PROPERTIES
Mix ratio by weight,
resin to hardener:
Mixed viscosity @ 25°C, cps:
Work-life @ 25°C
Gel time @ 25°C
Cure schedule @ 25°C
Cure schedule @ 65°C
Cure schedule @ 100°C
Color
Specific gravity:
Operating temp, °C
Hardness, shore D:
Izod impact, F1 Lbs/Inch of notch
Thermal
conductivity W/(m-°C)
C.T.E. (ppm/°C)
Tensile strength (@25°C)
Tensile lap shear, psi
Dielectric strength (volts/mil)
Dielectric constant (1 KHz @ 25°C)
Dissipation factor, KH@ 25°C
Shelf life
ASIA
TM
1600
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
White
0.48
25
2360 psi
220
18 months*
100 to 5
33,000
45 Minutes
3-6 Hours
8 Hours
1 Hour
0.5 Hour
Blue
2.30
-70 to 115
90
0.49
0.85
25
9200 psi
2900
410
5.9
5.9
18 months*
TM
1600 produces a stable,
TM
1600 bonds