658-25ABT4 Wakefield Thermal Solutions, 658-25ABT4 Datasheet - Page 17

• Manufacturer Part Number: 658-25ABT4
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-25ABT4

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 4W @ 70°C
• Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 6.35 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1065

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
8
7
6
5
4
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
500
500
500
600
600
600
700
700
700
3
2
1
0
3
2
1
0
3
2
1
0
3
2
1
0
5
4
3
2
1
0
100
100
100
100
100
7
6
5
4
3
2
1
0
100
200
200
200
200
200
200
300
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
618-100AB
400
400
400
400
400
618-20AB
400
500
500
500
500
500
500
600
600
600
600
600
600
700
700
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700
700