658-25ABT4 Wakefield Thermal Solutions, 658-25ABT4 Datasheet - Page 7

• Manufacturer Part Number: 658-25ABT4
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-25ABT4

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 4W @ 70°C
• Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 6.35 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1065

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
2. Optional factory preapplied pressure-sensitive adhesive. See Page 3
PRODUCT FEATURES
919541 Series Heat Sink Thermal Performance
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Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.