624-25ABT4 Wakefield Thermal Solutions, 624-25ABT4 Datasheet - Page 13

• Manufacturer Part Number: 624-25ABT4
• Description: HEATSINK CPU 21MM SQ W/DBL TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 624r

Specifications of 624-25ABT4

• Height: 0.250" (6.35mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 21.00mm x 21.00mm
• Thermal Resistance @ Forced Air Flow: 25°C/W @ 200 LFM
• Packages Cooled: BGA / LED
• Width: 21mm
• Heat Sink Material: Aluminum
• Length: 21mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Color: Black
• Product: Heatsinks
• Mounting Style: Screw
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 21 mm L x 21 mm W x 6.4 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1059

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
3
2
1
0
7
6
5
4
3
2
1
0
4
3
2
1
0
100
100
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
100
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
500
500
500
500
500
600
600
600
600
600
700
700
700
700
700
3
2
1
0
1