233-60AB-10 Wakefield Thermal Solutions, 233-60AB-10 Datasheet - Page 15

• Manufacturer Part Number: 233-60AB-10
• Description: HEATSINK TO-220 VERT BLK W/TABS
• Manufacturer: Wakefield Thermal Solutions
• Series: 233r

Specifications of 233-60AB-10

• Height: 0.725" (18.415mm)
• Package Cooled: TO-220
• Attachment Method: Bolt On
• Outline: 14.48mm x 12.70mm
• Power Dissipation @ Temperature Rise: 2W @ 58°C
• Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM
• Thermal Resistance @ Natural: 29°C/W
• Packages Cooled: TO-220
• Thermal Resistance: 29°C/W
• Width: 14.5mm
• Heat Sink Material: Aluminum
• Mounting Type: PC Board Through Hole
• Length: 12.7mm
• Package / Case: TO-220
• Color: Black
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 13.21 mm L x 12.7 mm W x 15.24 mm H
• Designed For: TO-220
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 345-1015

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards.
Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
Notes:
1. Thermal compound is
2. Tab temp with longer heat
assumed between device
and heat sink.
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
634 SERIES
637-25ABP
Material: Aluminum, Black Anodized.
637 SERIES
Standard
P/N
637-10ABP
637-15ABP
637-20ABP
Material: Aluminum, Black Anodized
634-10ABP
634-15ABP
634-20ABP
Plain Pin
Standard
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
High-Efficiency Heat Sinks For Vertical Board Mounting
P/N
PC Board “A”
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
Height Above
in. (mm)
Without Pin
634-10AB
634-15AB
634-20AB
(EXTRUSION PROFILE 5183)
634 SERIES
637 SERIES
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
Maximum Footprint
in. (mm)
Height Above
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
PC Board
in. (mm)
44
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
and board space occupied must be minimized. Refer to the Accessory products section for
thermal interface materials, thermal compounds, and other accessories products.
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
76°C @ 6W
55°C @ 6W
48°C @ 6W
Thermal Performance at Typical Load
65°C @ 6w
Convection
Natural
TYPICAL THERMAL PERFORMANCE
Dimensions
Footprint
in. (mm)
CONVECTION CHARACTERISTICS
FOR 634-15ABP
NATURAL AND FORCED
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
Convection
Forced
0.025 (11.21)
0.033 (14.95)
lbs. (grams)
0.016 (7.48)
TO-220 and TO-218
Weight
0.023 (10.43)
0.062 (28.12)
0.035 (15.88)
0.050 (22.68)
Normally stocked
lbs. (grams)
Weight
TO-220