233-60AB-10 Wakefield Thermal Solutions, 233-60AB-10 Datasheet - Page 5

HEATSINK TO-220 VERT BLK W/TABS

233-60AB-10

Manufacturer Part Number
233-60AB-10
Description
HEATSINK TO-220 VERT BLK W/TABS
Manufacturer
Wakefield Thermal Solutions
Series
233r
Datasheets

Specifications of 233-60AB-10

Height
0.725" (18.415mm)
Package Cooled
TO-220
Attachment Method
Bolt On
Outline
14.48mm x 12.70mm
Power Dissipation @ Temperature Rise
2W @ 58°C
Thermal Resistance @ Forced Air Flow
11.0°C/W @ 400 LFM
Thermal Resistance @ Natural
29°C/W
Packages Cooled
TO-220
Thermal Resistance
29°C/W
Width
14.5mm
Heat Sink Material
Aluminum
Mounting Type
PC Board Through Hole
Length
12.7mm
Package / Case
TO-220
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
13.21 mm L x 12.7 mm W x 15.24 mm H
Designed For
TO-220
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
345-1015
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Material: Aluminum,
Black Anodized
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
240-118ABH-22
273-AB
274 SERIES
281 SERIES
273 SERIES
Standard
P/N
273-AB
273-AB-01
273-AB-02
Material: Aluminum, Black Anodized
274 SERIES
Standard
P/N
274-1AB
274-1AB-01
274-1AB-02
274-2AB
274-2AB-01
274-2AB-02
274-3AB
274-3AB-01
274-3AB-02
281-1AB
281-2AB
240 SERIES
Standard
P/N
240-118ABH-22
240-118ABS-22
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
240-118ABS-22
Height Above
Height Above
Low-Cost, Low-Height Wavesolderable Heat Sinks
Low-Cost, Low-Height Wavesolderable Heat Sinks
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
Labor-Saving Twisted Fin Heat Sinks
.375 (9.5)
.375 (9.5)
.375 (9.5)
PC Board
PC Board
in. (mm)
in. (mm)
Height Above
1.180 (30.0)
1.180 (30.0)
PC Board
in. (mm)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
273-AB-01
Dimensions
Dimensions
Footprint
Footprint
in. (mm)
in. (mm)
Dimensions
Footprint
in. (mm)
240 SERIES
Dimensions: in. (mm)
273 SERIES
274 SERIES
274-XAB-01
34
Configuration
Configuration
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Mounting
Mounting
Configuration
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Mounting
Vertical
Vertical
273-AB-02
Tab Options
Tab Options
Solderable
Solderable
Tab Options
Solderable
No Tab
No Tab
No Tab
No Tab
No Tab
No Tab
01
02
01
02
01
02
01
02
22
22
274-XAB-02
Clip/Mtg Hole
Clip/Mtg Slot
Mounting
Mounting
Mounting
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Style
Style
Style
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
49°C @ 2W
62°C @ 2W
55°C @ 4W
55°C @ 4W
Convection
49°C @ 2W
49°C @ 2W
56°C @ 2W
56°C @ 2W
56°C @ 2W
50°C @ 2W
50°C @ 2W
50°C @ 2W
62°C @ 2W
62°C @ 2W
56°C @ 2W
50°C @ 2W
NATURAL AND FORCED
Convection
Thermal Performance at Typical Load
Thermal Performance at Typical Load
Convection
Thermal Performance at Typical Load
NATURAL AND FORCED
Natural
Natural
Natural
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
Convection
Convection
Convection
TO-218, TO-220
Forced
Forced
Forced
Normally stocked
TO-220
TO-220

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