ICS85102AGI IDT, Integrated Device Technology Inc, ICS85102AGI Datasheet - Page 12

no-image

ICS85102AGI

Manufacturer Part Number
ICS85102AGI
Description
Manufacturer
IDT, Integrated Device Technology Inc
Type
Clock Driverr
Datasheet

Specifications of ICS85102AGI

Number Of Clock Inputs
2
Output Frequency
500MHz
Output Logic Level
HCSL
Operating Supply Voltage (min)
2.97V
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.63V
Package Type
TSSOP
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ICS85102AGILF
Manufacturer:
IDT Integrated Device Technolo
Quantity:
135
Part Number:
ICS85102AGILF
Manufacturer:
IDT
Quantity:
46
Company:
Part Number:
ICS85102AGILFT
Quantity:
503
This section provides information on power dissipation and junction temperature for the ICS85102I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85102I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
flow and a multi-layer board, the appropriate value is 100.3°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
IDT
ABLE
ICS85102I
LOW SKEW, 1-TO-2, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER
/ ICS
6. T
Multi-Layer PCB, JEDEC Standard Test Boards
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 2 * 47.3mW = 94.6mW
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above)
T
85°C + 0.193W * 100.3°C/W = 104.4°C. This is well below the limit of 125°C.
JA
A
0.7V HCSL FANOUT BUFFER
= Ambient Temperature
HERMAL
= Junction-to-Ambient Thermal Resistance
R
MAX
ESISTANCE
_MAX
= V
MAX
(3.63V, with all outputs switching) = 98.01mW + 94.6mW = 192.61mW
= 47.3mW/Loaded Output pair
DD_MAX
* I
JA
DD_MAX
FOR
= 3.63V * 27mA = 98.01mW
16-L
DD
= 3.3V + 10% = 3.63V, which gives worst case results.
P
EAD
JA
by Velocity (Meters per Second)
OWER
JA
TSSOP, F
* Pd_total + T
C
ORCED
ONSIDERATIONS
A
100.3°C/W
12
C
ONVECTION
0
TM
devices is 125°C.
96.0°C/W
1
ICS85102AGI REV. A JUNE 10, 2008
JA
must be used. Assuming no air
93.9°C/W
2.5

Related parts for ICS85102AGI