SA555D-T NXP Semiconductors, SA555D-T Datasheet - Page 3

• Manufacturer Part Number: SA555D-T
• Manufacturer: NXP Semiconductors

Specifications of SA555D-T

• Lead Free Status / RoHS Status: Not Compliant

1. The junction temperature must be kept below 125 C for the D package and below 150 C for the N package.
Philips Semiconductors
EQUIVALENT SCHEMATIC
ABSOLUTE MAXIMUM RATINGS
NOTE:
2003 Feb 14
V
P
T
T
T
T
amb
amb
stg
SOLD
CC
D
Timer
NOTE: Pin numbers are for 8-Pin package
At ambient temperatures above 25 C, where this limit would be derated by the following factors:
SYMBOL
D package 160 C/W
N package 100 C/W
Supply voltage
Maximum allowable power dissipation
Operating ambient temperature range
Storage temperature range
Lead soldering temperature (10 sec max)
THRESHOLD
DISCHARGE
SE555
NE555, SE555C, SA555
NE555
SA555
SE555, SE555C
TRIGGER
RESET
V
GND
CC
Q5
Q14
Q1
R1
4.7 k
Q25
Q2
Q6
PARAMETER
Q3
R5
10 k
Q7
R2
330
Figure 3. Equivalent schematic
R16
100
100 k
1
Q10
Q4
R3
4.7 k
R6
Q8
Q11 Q12
Q9
R4
1 k
3
Q13
5 k
5 k
R9
R8
R7
5 k
Q15
Q18
CB
E
FM
Q16
R10
82 k
R11
4.7 k
CONTROL VOLTAGE
Q17
Q19
NE/SA/SE555/SE555C
Q20
R12
6.8
k
C
–55 to +125
–65 to +150
Q21
R14
220
R15
4.7 k
–40 to +85
Q23
RATING
0 to +70
R13
3.9 k
+230
+18
+16
600
B
SL00351
Q22
Q24
OUTPUT
Product data
UNIT
mW
V
V
C
C
C
C
C