UJA1065TW/3V3.512 NXP Semiconductors, UJA1065TW/3V3.512 Datasheet - Page 68

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UJA1065TW/3V3.512

Manufacturer Part Number
UJA1065TW/3V3.512
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of UJA1065TW/3V3.512

Number Of Transceivers
1
Power Down Mode
Standby
Operating Supply Voltage (min)
5.5V
Supply Current
10mA
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Lead Free Status / RoHS Status
Supplier Unconfirmed
NXP Semiconductors
12. Package outline
Fig 29. Package outline SOT549-1 (HTSSOP32)
UJA1065_7
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 07 — 25 February 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
High-speed CAN/LIN fail-safe system basis chip
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1065
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
68 of 76
A

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