JL82571EB Intel, JL82571EB Datasheet - Page 12

• Manufacturer Part Number: JL82571EB
• Manufacturer: Intel

Specifications of JL82571EB

• Lead Free Status / RoHS Status: Supplier Unconfirmed

2.7
8
Technology Features
256-pin Flip-Chip Ball Grid Array (FC-BGA) package
Implemented in 90 nm CMOS process
Operating temperature:
1000BASE-T, 0
1000BASE-T, 0
management)
1000BASE-SX/LX (or SERDES backplane), 0
Storage temperature 65
Typical targeted power dissipation:
~3.50 W @ D0 1000 Mbps
~0.78mW @ D3 100 Mbps (wakeup enabled)
~0.36mW @ D3 wakeup disabled
°
°
C to 55
C to 70
°
°
°
C (with thermal management)
C to 140
C (with increased thermal
Features
°
C
°
C to 70
82571/82572 Gigabit Ethernet Controller—Datasheet
°
C
• 17 mm X 17 mm component
• Offers lowest geometry to minimize
• Simple thermal design
• Minimizes impact of incorporating
occupies only 28% more board
space than a single port device
power and size while maintaining
Intel quality and reliability standards
Gigabit instead of Fast Ethernet.
Benefits