CPC7593ZC IXYS, CPC7593ZC Datasheet

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CPC7593ZC

Manufacturer Part Number
CPC7593ZC
Description
Manufacturer
IXYS
Datasheet

Specifications of CPC7593ZC

Lead Free Status / RoHS Status
Supplier Unconfirmed
Features
Applications
DS-CPC7593 - R02
TTL logic level inputs for 3.3V logic interfaces
Smart logic for power up / hot plug state control
Improved switch dv/dt immunity of 500 V/µs
Small 20 pin or 28 pin SOIC or 28 pin
micro-leadframe (MLP) package
MLP version provides 65% PCB area reduction over
4
Monolithic IC reliability
Low, matched, R
Eliminates the need for zero-cross switching
Flexible switch timing for transition from ringing
mode to talk mode.
Clean, bounce-free switching
SLIC tertiary protection via integrated current
limiting, voltage clamping and thermal shutdown
5 V operation with power consumption < 10.5 mW
Intelligent battery monitor
Logic-level inputs, no external drive circuitry required
Standard voice linecards
Integrated Voice and Data (IVD) linecards
Central office (CO)
Digital Loop Carrier (DLC)
PBX Systems
Digitally Added Main Line (DAML)
Hybrid Fiber Coax (HFC)
Fiber in the Loop (FITL)
Pair Gain System
Channel Banks
th
Ring
Tip
generation EMRs
T
T
R
R
Secondary
Protection
TESTin
TESTout
TESTout
TESTin
(R
(T
(T
(R
CHANTEST
CHANTEST
DROPTEST
DROPTEST
ON
T
R
LINE
)
)
LINE
)
)
22
7
V
BAT
X
X
10
19
SW6
SW5
RINGING
X
X
8
20
SW3
SW4
300 (min.)
T
R
RINGING
SW7
SW1
SW2
SW8
RINGING
X
X
X
X
X
X
24
5
SW9
SW10
www.clare.com
NOTE 1: Pin assignments are for the 28 pin package.
NOTE 2: Block diagram shown with the optional protection SCR.
1
CPC7593
F
GND
Circuit
SCR
Trip
Description
The CPC7593 is a member of Clare’s next generation
Line Card Access Switch (LCAS) family. This
monolithic 10-pole line card access switch is available
in a 20 or 28 pin SOIC or a 28 pin MLP package. It
provides the necessary functions to replace three
2-Form-C electromechanical relays on analog line
cards or combined voice and data line cards found in
central office, access, and PBX equipment. The
device contains solid state switches for tip and ring line
break, ringing injection and test access. The CPC7593
requires only a +5 V supply and provides stable start
up conditioning during system power up and for hot
plug insertion applications. Once active, the inputs
respond to traditional TTL logic levels enabling the
CPC7593 to be used with 3.3V only logic.
Ordering Information
For delivery in tubes, specify CPC7593Zx for the 20
pin SOIC (38/tube), CPC7593Bx for the 28 pin SOIC
(27/tube), or CPC7593Mx for the MLP (54/tube). For
tape and reel delivery, add “TR”, sans quotes to the
part number. SOIC: 20 or 28 pin (500/reel), MLP
(1000/reel).
CPC7593xA
CPC7593xB
CPC7593xC
CPC7593xD
Part Number
V
V
BAT
REF
28
Description
With protection SCR
Without protection SCR
Extra logic state and protection SCR
Extra logic state but without protection SCR
Control
Switch
+5 Vdc
Logic
Line Card Access Switch
12
14
D
GND
V
13
DD
C
H
L
A
T
6
23
17
16
15
18
T
R
BAT
BAT
CPC7593
IN
IN
IN
LATCH
T
SD
TESTin
RINGING
TESTout
SLIC
1

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CPC7593ZC Summary of contents

Page 1

Features • TTL logic level inputs for 3.3V logic interfaces Smart logic for power up / hot plug state control • • Improved switch dv/dt immunity of 500 V/µs • Small 20 pin or 28 pin SOIC or 28 pin ...

Page 2

CPC7593 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

Specifications 1.1 Package Pinout CPC7593B & CPC7593M F 1 GND TESTin T 6 BAT T 7 LINE T 8 RINGING TESTout ...

Page 4

CPC7593 1.3 Absolute Maximum Ratings Parameter Minimum Maximum +5 V power supply (V ) -0.3 DD Battery Supply - GND GND -5 separation V Logic input voltage -0.3 Logic input to switch output - isolation Switch open-contact ...

Page 5

Switch Specifications 1.6.1 Break Switches, SW1 and SW2 Parameter Test Conditions V (differential SW1 V (differential SW2 All-Off state. +25° (differential) = -320 V to gnd SW V (differential) = +260 V to ...

Page 6

CPC7593 1.6.2 Ringing Return Switch, SW3 Parameter Test Conditions V (differential SW3 All-Off state. +25° (differential) = -320 V to gnd SW V (differential) = +260 Off-State +85° C, Leakage Current ...

Page 7

Ringing Switch, SW4 Parameter Test Conditions V (differential SW4 All-Off state. +25° (differential) = -255 V to +210 (differential) = +255 V to -210 V SW Off-State +85° C Leakage Current V ...

Page 8

CPC7593 1.6.4 TESTout Switches, SW5 and SW6 Parameter Test Conditions V (differential SW5 V (differential SW6 All-Off state. +25° (differential) = -320 V to gnd SW V (differential) = +260 V to -60 V ...

Page 9

Ringing Test Return Switch, SW7 Parameter Test Conditions V (differential SW7 T RINGING All-Off state. +25° (differential) = -320 V to gnd SW V (differential) = +260 to -60 V Off-State SW Leakage Current +85° ...

Page 10

CPC7593 1.6.6 Ringing Test Switch, SW8 Parameter Test Conditions V (differential SW8 R RINGING All-Off state. +25° C, Off-State V (differential +175 V SW Leakage current +85° (differential ...

Page 11

TESTin Switches, SW9 and SW10 Parameter Test Conditions V (differential SW9 V (differential SW10 All-Off state. +25° (differential) = -320 V to gnd SW V (differential) = +260 V to -60 V Off-state ...

Page 12

CPC7593 1.7 Digital I/O Electrical Specifications Parameter Test Conditions Input Characteristics Input voltage, Logic low Input voltage falling Input voltage, Logic high Input voltage rising Input leakage current 5 RINGING TESTin DD ...

Page 13

Voltage and Power Specifications Parameter Test Conditions Voltage Requirements BAT used only for internal protection circuitry BAT drops below -15 V Power Specifications -48 ...

Page 14

CPC7593 1.10 Truth Tables 1.10.1 Truth Table for CPC7593xA and CPC7593xB State RINGING TESTin Talk 0 0 TESTout 0 0 TESTin 0 1 Simultaneous TESTin and 0 1 TESTout Ringing 1 0 Ringing Generator 1 1 Test ...

Page 15

Functional Description 2.1 Introduction The CPC7593 has the following states: • Talk. Loop break switches SW1 and SW2 closed, all other switches open. • Ringing. Ringing switches SW3 and SW4 closed, all other switches open. TESTout. Testout switches SW5 ...

Page 16

CPC7593 To facilitate hot plug insertion and system power up state control, the LATCH pin has an integrated weak pull up resistor to the V power rail that will hold a DD non-driven LATCH pin at a logic high state. ...

Page 17

Make-Before-Break Operation Logic Table (Ringing to Talk Transition State RINGING TESTin TESTout Ringing Make- Before Break Talk 2.3.5 Break-Before-Make Operation Break-before-make operation of the CPC7593 can be ...

Page 18

CPC7593 Although logically disabled, an active (closed) ringing switch (SW4) will remain closed until the next current zero crossing event. As shown in the table “Break-Before-Make Operation Logic Table (Ringing to Talk Transition)” on page operation is similar to the ...

Page 19

T Pin Description SD The T pin is a bi-directional I/O structure with an SD internal pull up sourced from output, this DD pin indicates the status of the thermal shutdown circuitry. Typically, during normal ...

Page 20

CPC7593 For power induction or power-cross fault conditions, the positive cycle of the transient is clamped to a diode drop above ground and the fault current is directed to ground. The negative cycle of the transient will cause the SCR ...

Page 21

Manufacturing Information 3.1 Mechanical Dimensions 3.1.1 CPC7593Z - 20 Pin SOIC Package PIN 20 PIN 1 12.60 MIN - 13.00 MAX (0.496 MIN - 0.512 0.508 MAX - 0.762 MAX (0.020 MIN - 0.030 MAX) 1.27 TYP (0.050 TYP) ...

Page 22

CPC7593 3.1.2 CPC7593B - 28 Pin SOIC Package 17.983 MIN/18.085 MAX (0.708 MIN/0.712 MAX) PIN 28 PIN 1 1.270 TYP (0.050 TYP) 2.438 MIN/2.642 MAX (0.096 MIN/0.104 MAX) 0.366 MIN/0.467 MAX TYP (0.014 MIN/0.018 MAX TYP) 3.1.3 CPC7593M - 28 ...

Page 23

Tape and Reel Specifications 3.2.1 CPC7593Z - Tape and Reel Dimensions 330.2 DIA. (13.00 DIA) Top Cover Tape Thickness 0.102 MAX (0.004 MAX) Embossed Carrier Embossment 3.2.2 CPC7593B - Tape and Reel Dimensions 330.2 DIA. (13.00 DIA) Top Cover ...

Page 24

CPC7593 3.3 Soldering 3.3.1 Moisture Reflow Sensitivity Clare has characterized the moisture reflow sensitivity of LCAS products using IPC/JEDEC standard J-STD-020. Moisture uptake from atmospheric humidity occurs by diffusion. During the solder reflow process, in which the component is attached ...

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