HBLXT9785HC.A4 Intel, HBLXT9785HC.A4 Datasheet - Page 223

• Manufacturer Part Number: HBLXT9785HC.A4
• Manufacturer: Intel

Specifications of HBLXT9785HC.A4

• Lead Free Status / RoHS Status: Not Compliant

Datasheet
Document Number: 249241
Revision Number: 010
Revision Date: 30-May-2006
Figure 66. 241-Ball BGA23 Package Specificationss - Bottom View (LXT9785BC)
Table 102. 241-Ball BGA23 Package Dimensions
All dimensions and tolerances conform to ANSI Y14.5-1982. Dimension is measured at maximum solder ball
diameter parallel to primary datum (-C-). Primary datum (-C-) and seating plane are defined by the spherical
crowns of the solder balls.
Symbol
A1
A2
D1
E1
M
D
A
E
e
b
e
J
c
I
LXT9785 and LXT9785E Advanced 8-Port 10/100 Mbps PHY Transceivers
J
2.19
0.50
1.12
22.90
19.30
22.90
19.30
1.27 (solder ball pitch)
1.34 REF.
1.34 REF.
17 x 17 Matrix
0.60
0.52
e
b
Min
l
17
16
15
2.38
0.60
1.17
23.00
19.50
23.00
19.50
0.75
0.56
1.27
14
Nominal
13
12
11
10
Bottom View
241 BGA
2.57
0.70
1.22
23.10
19.70
23.10
19.70
0.90
0.60
9
8
Max
7
6
5
4
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
3
e
Units
2
1
Pin A1 corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
Note
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