AM79C2031JC AMD (ADVANCED MICRO DEVICES), AM79C2031JC Datasheet - Page 36

• Manufacturer Part Number: AM79C2031JC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of AM79C2031JC

• Lead Free Status / RoHS Status: Supplier Unconfirmed

36
Thermal Management Equations (Normal Active and Tip Open States)
Thermal Management equations (Polarity Reverse State)
Note: ASLIC device die temperature should not exceed 140°C.
Z
Z
R
P
P
P
T
ThetajA
RTMG
SLIC
SLIC
T
RX
SLIC
TMG
=
=
63.5
=
=
=
=
----------- -
G
=
Z
V
V
P
42L
V
------------------------------------ -
L
---------------------------------------------------------------------------------- -
SLIC
jA
BAT
BAT
BAT
V
BAT
Z
I
=
LOOP
2WIN
-------------------------------------------------------- -
Z
–
T
43
I
I
VOFF
–
+
LOOP
LOOP
jA
VOFF
63.5
–
+
watt
254 Z
2R
T
–
–
R
AMBIENT
F
TMG
P
–
R
RTMG
Z
L
L
T
I
LOOP
+
2R
I
–
LOOP
R
F
Table 10. User-Programmable Components
L
R
L
2
Am79213/Am79C203/031 Data Sheet
I
LOOP
+
2
0.12 W
P R E L I M I N A R Y
2
+
0.12 W
Z
sistors are R
ance. When computing Z
and any external stray capacitance between VTX and RSN
must be taken into account.
Z
G
R
power dissipation within the ASLIC device in normal Active
and Tip Open states.
Power dissipated in the thermal management resistor, R
during normal Active and Tip Open states
Power dissipated in the ASLIC device while in normal Active
and Tip Open states
Power dissipated in the ASLIC device while in the Polarity
Reverse state
Total die temperature
Thermal impedance of the 32-pin plastic leaded chip carrier
package
T
RX
TMG
42L
is connected between the VTX and RSN pins. The fuse re-
is connected from VRX to RSN. Z
is the desired receive gain.
is connected from TMG to VBAT and is used to reduce
F
. Z
2WIN
is the desired 2-wire AC input imped-
T
, the internal current amplifier pole
T
is defined above, and
TMG
,