HC55130IBZ Intersil, HC55130IBZ Datasheet - Page 36

HC55130IBZ

Manufacturer Part Number
HC55130IBZ
Description
Manufacturer
Intersil
Datasheet

Specifications of HC55130IBZ

Number Of Channels
1
On-hook Transmission
Yes
Polarity Reversal
No
On-chip Ring Relay Driver
Yes
Longitudinal Balanced
63
Operating Supply Voltage (typ)
5V
Operating Temp Range
-40C to 85C
Loop Current Limit
45mA
Operating Temperature Classification
Industrial
Pin Count
28
Mounting
Surface Mount
Operating Current
2.7mA
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Lead Free Status / RoHS Status
Compliant
Plastic Leaded Chip Carrier Packages (PLCC)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
NE
0.042 (1.07)
0.048 (1.22)
0.020 (0.51) MAX
3 PLCS
PIN (1)
IDENTIFIER
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
0.025 (0.64)
MIN
0.050 (1.27)
MIN
C L
D1
D
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
For information regarding Intersil Corporation and its products, see www.intersil.com
0.050 (1.27) TP
VIEW “A” TYP.
36
0.042 (1.07)
0.056 (1.42)
ND
E1
E
(0.12)
0.005
0.013 (0.33)
0.021 (0.53)
0.026 (0.66)
0.032 (0.81)
C L
M
A
A S
A1
-C-
- B S
0.004 (0.10)
D2/E2
D2/E2
0.025 (0.64)
0.045 (1.14)
SEATING
PLANE
VIEW “A”
0.015 (0.38)
MIN
D S
R
C
N32.45x55
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: INCH. Converted millimeter dimen-
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Al-
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
ND
NE
A1
D1
D2
E1
E2
sions are not necessarily exact.
lowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are mea-
sured at the extreme material condition at the body parting
line.
body.
package, one of which contains pin #1. NE denotes the num-
ber of leads on the two long sides of the package.
D
N
A
E
0.125
0.060
0.485
0.447
0.188
0.585
0.547
0.238
MIN
(JEDEC MS-016AE ISSUE A)
INCHES
28
7
9
MAX
0.140
0.095
0.495
0.453
0.223
0.595
0.553
0.273
12.32
11.36
14.86
13.90
MILLIMETERS
3.18
1.53
4.78
6.05
MIN
-C-
28
7
9
contact point.
12.57
11.50
15.11
14.04
MAX
3.55
2.41
5.66
6.93
Rev. 0 7/98
June 1, 2006
NOTES
FN4659.13
4, 5
4, 5
6
3
3
7
7
-
-
-
-

Related parts for HC55130IBZ