BK1005HS102-T Taiyo Yuden, BK1005HS102-T Datasheet - Page 51
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BK1005HS102-T
Manufacturer Part Number
BK1005HS102-T
Description
FERRITE BEAD 1000OHM 0402
Manufacturer
Taiyo Yuden
Series
BKr
Datasheets
1.BK1005LM182-T.pdf
(27 pages)
2.BKP1608HS181-T.pdf
(53 pages)
3.BK1005HS102-T.pdf
(1 pages)
Specifications of BK1005HS102-T
Impedance @ Frequency
1K Ohm @ 100MHz
Current Rating
300mA
Dc Resistance (dcr)
580.0 mOhm Max
Filter Type
Differential Mode - Single
Number Of Lines
1
Package / Case
0402 (1005 Metric)
Mounting Type
Surface Mount
Impedance
1kohm
Ferrite Grade
HS
Dc Resistance Max
0.58ohm
Dc Current Rating
300mA
Ferrite Mounting
SMD
Ferrite Case Style
0402 / 1005
Rohs Compliant
Yes
Reel Quantity
10000
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
587-1841-2
BK1005HS102-T
BK1005HS102-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BK1005HS102-T
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Part Number:
BK1005HS102-TV
Manufacturer:
TAIYO/太诱
Quantity:
20 000
RECTANGULAR FERRITE CHIP BEADS (HIGH CURRENT) FB series M type
Note on standard condition: "standard condition" referred to herein is defined as follows 5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity
1.Operating Temperature Range
2.Storage Temperature Range
3.Impedance
4. DC Resistance
5.Rated Current
6.Vibration
7. Solderability
8.Resistance to Solder Heat
9.Thermal Shock
10.Humidity (steady state)
11. L o a d i n g u n d e r D a m p
12.High Temperature Loading
13.Resistance to Flexure of
14.Adhesion of Electrode
RELIABILITY DATA
Test
Substrate
Heat
Item
ー40∼+85℃
ー40∼+85℃
Within the specified tolerance
Within the specified range
Within the specified range
Appearance: No significant abnormality
Impedance change: Within ±30% of the initial value
75% or more of immersed surface of terminal electrode shall be covered
with fresh solder.
Appearance: No significant abnormality
Impedance change: Within ±30% of the initial value
Appearance: No significant abnormality
Impedance change: Within % of the initial value
Appearances: No significant abnormality
Impedance change: Within ±30% of the initial value
Appearance : No significant abnormality
Impedance change : Within ±30% of the initial value
Appearance: No significant abnormality
Impedance change: Within ±30% of the initial value
No mechanical damage.
No separation or indication of separation of electrode.
and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
+50
ー10
Specified Value
*Note: 0 to +40℃ in taped packaging
Measuring equipment: Impedance analyzer (HP4291A) or its equivalent
Measuring frequency: 100±1 MHZ
Four-terminal method
Measuring equipment: Milliohm High-Tester 3226 ( Hioki Denki) or its equivalent
According to JIS C 0040.
Vibration type: A
Directions: 2 hrs each in X,Y, and Z directions
Frequency range: 10 to 55 to 10Hz ( /min.)
Amplitude: 1.5 mm (shall not exceed acceleration 196m/s
Mounting method: Soldering onto PC board
Solder temperature: 230±5℃
Duration: 4±1 sec.
Preconditioning: Immersion into flux.
Immersion and Removal speed: 25mm/sec.
Preheating: 150℃ for 3 min.
Solder temperature: 260±5℃
Duration: 10±0.5sec
Preconditioning: Immersion into flux.
Immersion and Removal speed: 25 mm/sec.
Recovery: 2 to 3 hrs of recovery under the standard condition after the test.
According to JIS C 0025.
Conditions for 1 cycle
Number of cycles: 100
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
Temperature: 40±2˚C
Humidity: 90 to 95%RH
Duration: 500
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
Temperature : 40±2˚C
Humidity : 90 to 95%RH
Applied current : Rated current
Duration : 500
Mounting method : Soldering onto PC board
Recovery : 2 to 3hrs of recovery under the standard condition after the removal
Temperature: 85±2℃
Duration: 500
Applied current: Rated current
Mounting method: Soldering onto PC board
Recovery: 2 to 3 hrs of recovery under the standard condition after the removal
Warp: 2mm
Testing board: Glass epoxy-resin substrate
Thickness: 0.8mm
Applied force: 5N
Duration: 10 sec.
8
Step
1
2
3
4
Room Temperature
Room Temperature
Temperature ( ℃)
from test chamber.
from test chamber.
from test chamber.
from test chamber.
ー40±3℃
ー85±2℃
+24
ー 0
+24
ー 0
+24
ー 0
hrs
hrs
hrs
Test Methods and Remarks
Duration ( min.)
Within 3
Within 3
30±3
30±3
Total: 6 hrs
2
)
273
5