BK2125HM601-T Taiyo Yuden, BK2125HM601-T Datasheet - Page 34

• Manufacturer Part Number: BK2125HM601-T
• Description: FERRITE BEAD 600 OHM 0805
• Manufacturer: Taiyo Yuden
• Series: BKr

Specifications of BK2125HM601-T

• Impedance @ Frequency: 600 Ohm @ 100MHz
• Current Rating: 500mA
• Dc Resistance (dcr): 250.0 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Package / Case: 0805 (2012 Metric)
• Mounting Type: Surface Mount
• Impedance: 600ohm
• Ferrite Grade: HM
• Dc Resistance Max: 0.25ohm
• Dc Current Rating: 500mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0805 / 2012
• Frequency Max: 300MHz
• Rohs Compliant: Yes
• Features: HM
• Frequency: 100MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-1902-2; BK2125HM601-T

Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
1. Circuit Design
2. PCB Design
PRECAUTIONS
Stages
◆Verification of operating environment, electrical rating
1. A malfunction in medical equipment, spacecraft, nucle-
◆Operating Current （Verification of Rated current）
1. The operating current for inductors must always be
2. Do not apply current in excess of the rated value
（1） The amount of solder applied can affect the ability
（2） When more than one part is jointly soldered onto
（3） The larger size of land patterns and amount of
◆Pattern configurations
1. When inductors are mounted on a PCB, the size of
（Design of Land-patterns）
and performance
ar reactors, etc. may cause serious harm to human
life or have severe social ramifications. As such, any
inductors to be used in such equipment may require
higher safety and/or reliability considerations and
should be clearly differentiated from components used
in general purpose applications.
lower than their rated values.
because the inductance may be reduced due to the
magnetic saturation effect.
land patterns and the amount of solder used （size
of fillet） can directly affect inductor performance.
Therefore, the following items must be carefully con-
sidered in the design of solder land patterns:
of chips to withstand mechanical stresses which
may lead to breaking or cracking. Therefore, when
designing land-patterns it is necessary to consider
the appropriate size and configuration of the solder
pads which in turn determines the amount of solder
necessary to form the fillets.
the same land or pad, the pad must be designed so
that each component's soldering point is separated
by solder-resist.
solder, the smaller Q value after mounting on PCB.
It makes higher the Q value to design land patterns
smaller than terminal electrode of chips.
Precautions
（1） Recommended land dimensions for a typical chip inductor land patterns
1. The following diagrams and tables show some examples of recommended
Recommended land dimensions for wave-soldering （unit: mm）
Recommended land dimensions for reflow-soldering （unit: mm）
Excess solder can affect the ability of chips to withstand mechanical stresses.
Therefore, please take proper precautions when designing land-patterns.
Type
patterns to prevent excessive solder amounts （larger fillets which extend
above the component end terminations） . Examples of improper pattern
designs are also shown.
for PCBs
Type
A
B
C
B
C
A
W
L
W
L
0.20∼0.30 0.45∼0.55 0.50∼0.55 0.6∼0.8
0.20∼0.30 0.40∼0.50 0.30∼0.40 0.6∼0.8
0.25∼0.40 0.45∼0.55 0.60∼0.70 0.6∼0.8
8
0603
0.6
0.3
0.8∼1.0
0.5∼0.8
0.6∼0.8
1608
1.6
0.8
1005
1.0
0.5
Technical considerations
1.0∼1.4
0.8∼1.5
0.9∼1.2
2125
1.25
2.0
105
1.0
0.6
1608
1.8∼2.5
0.8∼1.7
1.2∼1.6
1.6
0.8
Recommended land
dimension for
Reflow-soldering （unit: mm）
3216
3.2
1.6
a
b
c
d
0.8∼1.2
0.8∼1.2
0.9∼1.6
2125
1.25
W
L
2.0
0.7
0.8
0.4
3216
1.8∼2.5
0.6∼1.5
1.2∼2.0
3.2
1.6
0.8
∼
∼
∼
3216
3.2
1.6
0.9
1.0
0.5
0.5
0.5
0.2
1.0∼1.4
0.6∼1.0
1.8∼2.2
2010
1/7
2.0
1.0
0.5
∼
∼
∼
2520
2.5
2.0
0.6
0.6
0.3
249
5