FBMJ2125HM330-T Taiyo Yuden, FBMJ2125HM330-T Datasheet - Page 13

• Manufacturer Part Number: FBMJ2125HM330-T
• Description: FERRITE BEAD 33 OHM 0805
• Manufacturer: Taiyo Yuden
• Series: FBr

Specifications of FBMJ2125HM330-T

• Impedance @ Frequency: 33 Ohm @ 100MHz
• Current Rating: 4A
• Dc Resistance (dcr): 8.000 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Package / Case: 0805 (2012 Metric)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-1766-2; FBMJ2125HM330-T

FBM Type
△
！
PRECAUTIONS
1.Circuit Design
2.PCB Design
3.Considerations for
automatic placement
4.Soldering
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Stages
Stages
Operating environment,
1.The products described in this specification are intended for
Rated current
1.Rated current of this product is shown in this catalogue, but
Land pattern design
1.Please refer to a recommended land pattern.
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the products
2.Mounting and soldering conditions should be checked
Wave soldering
1.Please refer to the specifications in the catalog for a wave
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
Lead free soldering
1.When using products with lead free soldering, we request to
Preheating when soldering
Recommended conditions for using a soldering iron
use
equipment,
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
please be sure to have the base board designed with
adequate inspection in case of the generation of heat
becomes high within the rated current range when the base
board is in high resistance or in bad heating conditions.
when mounting onto the PC boards.
beforehand.
soldering.
refer to the recommended condition specified.
use them after confirming of adhesion, temperature of
resistance to soldering heat, etc. sufficiently.
Heating:The temperature difference between soldering and
remaining heat should not be greater than 150℃.
Cooling:The temperature difference between the components
and cleaning process should not be greater than 100℃.
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
in
general
telecommunications
electronic
Precautions
Precautions
equipment,(office
systems,
measuring
supply
1.When installing products, care should be taken not to apply distortion stress as it may
1.If products are used beyond the range of the recommended conditions, heat stresses
1.There is a case that products get damaged by a heat shock.
1.If products are used beyond the range of the recommended conditions, heat stresses
deform the products.
may deform the products, and consequently degrade the reliability of the products.
may deform the products, and consequently degrade the reliability of the products.
250
200
150
100
Recommended reflow condition （Pb free solder）
50
0
180℃
150℃
90±30sec.
Duration （ sec）
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！
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
30±10sec
Technical considerations
Technical considerations
Peak 260℃ max
10sec max
230℃ min
250
200
150
100
50
Recommended reflow condition （Pb solder）
0
180℃
150℃
90±30sec.
Duration （ sec）
240±5℃
30±10sec
5sec max.
1/2
220±5℃
281
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