UBA2211BP/N1 NXP Semiconductors, UBA2211BP/N1 Datasheet - Page 14

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UBA2211BP/N1

Manufacturer Part Number
UBA2211BP/N1
Description
CFL DRIVER, HALF-BRIDGE, 8DIP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of UBA2211BP/N1

Driver Case Style
DIP
No. Of Pins
8
Operating Temperature Range
-40°C To +150°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
12. Package outline
Fig 8.
UBA2211
Preliminary data sheet
DIP8: plastic dual in-line package; 8 leads (300 mil)
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
Package outline SOT97-1 (DIP8)
OUTLINE
VERSION
SOT97-1
max.
0.17
4.2
A
min.
0.02
0.51
A
1
L
050G01
max.
0.13
3.2
A
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
All information provided in this document is subject to legal disclaimers.
MO-001
JEDEC
0.042
0.035
1.07
0.89
4
5
b
b
REFERENCES
1
2
0
Rev. 2.1 — 7 March 2011
A
b
0.014
0.009
1
0.36
0.23
2
w
c
A
E
M
2
SC-504-8
JEITA
scale
D
0.39
0.36
A
9.8
9.2
5
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
Half-bridge power IC family for CFL lamps
0.1
e
7.62
0.3
e
c
1
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
H
EUROPEAN
1
E
8.25
7.80
0.32
0.31
M
E
10.0
0.39
0.33
M
8.3
UBA2211
H
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
0.254
0.01
99-12-27
03-02-13
w
SOT97-1
0.045
max.
1.15
Z
(1)
14 of 19

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