OP496GS-REEL Analog Devices Inc, OP496GS-REEL Datasheet - Page 16

• Manufacturer Part Number: OP496GS-REEL
• Description: IC,Operational Amplifier,QUAD,BICMOS,SOP,16PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of OP496GS-REEL

• Rohs Status: RoHS non-compliant
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.3 V/µs
• Gain Bandwidth Product: 450kHz
• Current - Input Bias: 10nA
• Voltage - Input Offset: 35µV
• Current - Supply: 60µA
• Current - Output / Channel: 4mA
• Voltage - Supply, Single/dual (±): 3 V ~ 12 V, ±1.5 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• -3db Bandwidth: -

COPLANARITY
OUTLINE DIMENSIONS
COPLANARITY
ORDERING GUIDE
Model
OP196GSZ
OP296GSZ
OP296HRUZ
OP496GSZ
OP496HRUZ
1
Z = RoHS Compliant Part.
0.25 (0.0098)
0.10 (0.0039)
0.25 (0.0098)
0.10 (0.0040)
0.10
4.00 (0.1575)
3.80 (0.1496)
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
4.00 (0.1574)
3.80 (0.1497)
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 2. 14-Lead Standard Small Outline Package [SOIC_N]
Figure 1. 8-Lead Standard Small Outline Package [SOIC_N]
SEATING
PLANE
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
14
1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
8.75 (0.3445)
8.55 (0.3366)
COMPLIANT TO JEDEC STANDARDS MS-012-AB
5.00 (0.1968)
4.80 (0.1890)
1.27 (0.0500)
1
BSC
8
BSC
Temperature Range
−40°C to +85°C (Ambient)
−40°C to +85°C (Ambient)
−40°C to +85°C (Ambient)
−40°C to +85°C (Ambient)
−40°C to +85°C (Ambient)
5
4
7
0.51 (0.0201)
0.31 (0.0122)
8
6.20 (0.2441)
5.80 (0.2284)
Narrow Body
6.20 (0.2441)
5.80 (0.2283)
Narrow Body
SEATING
PLANE
1.75 (0.0688)
1.35 (0.0532)
1.75 (0.0689)
1.35 (0.0531)
(R-14)
(R-8)
0.25 (0.0098)
0.17 (0.0067)
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°
0.50 (0.0196)
0.25 (0.0099)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
1.27 (0.0500)
0.40 (0.0157)
45°
45°
Rev. D | Page 16
Package Description
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead TSSOP
14-Lead SOIC_N
14-Lead TSSOP
COPLANARITY
1.05
1.00
0.80
PIN 1
4.50
4.40
4.30
0.10
0.15
0.05
COPLANARITY
Figure 4. 14-Lead Thin Shrink Small Outline Package [TSSOP]
Figure 3. 8-Lead Thin Shrink Small Outline Package [TSSOP]
0.15
0.05
14
0.10
1
0.65 BSC
PIN 1
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
COMPLIANT TO JEDEC STANDARDS MO-153-AA
5.10
5.00
4.90
0.65 BSC
8
Dimensions shown in milllimeters
1
Dimensions shown in millimeters
3.10
3.00
2.90
0.30
0.19
8
7
5
4
BSC
SEATING
PLANE
6.40
SEATING
PLANE
1.20
MAX
1.20
MAX
4.50
4.40
4.30
(RU-14)
(RU-8)
OP196/OP296/OP496
6.40 BSC
Package Option
R-8
R-8
RU-8
R-14
RU-14
0.20
0.09
0.20
0.09
8°
0°
8°
0°
0.75
0.60
0.45
0.75
0.60
0.45