PIC18F4321-E/ML Microchip Technology, PIC18F4321-E/ML Datasheet - Page 12

• Manufacturer Part Number: PIC18F4321-E/ML
• Description: 8KB Flash, 512 Bytes RAM, 256 Bytes EEPROM, 36 I/O 44 QFN 8x8x0.9mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4321-E/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 44-QFN
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18F2221/2321/4221/4321
10. Module: Packaging Information
DS80310G-page 12
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
The 28-Lead Plastic Quad Flat, No Lead Package
(MM) illustration, on page 371, is replaced by the
one shown.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
D
e
A
E
L
K
b
E2
2
1
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
28
D2
–
Microchip Technology Drawing C04-105B
© 2008 Microchip Technology Inc.
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
b
K
e