UJA1069TW/5V0/C/T NXP Semiconductors, UJA1069TW/5V0/C/T Datasheet - Page 41
UJA1069TW/5V0/C/T
Manufacturer Part Number
UJA1069TW/5V0/C/T
Description
UJA1069TW/HTSSOP32/REEL13DP//5
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1069TW5V0CT.pdf
(64 pages)
Specifications of UJA1069TW/5V0/C/T
Applications
*
Interface
*
Voltage - Supply
*
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935288872518
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8. Thermal characteristics
UJA1069_4
Product data sheet
Fig 15. Thermal model of the HTSSOP32 package
Fig 16. Thermal model of the HTSSOP24 package
V1 dissipation
V1 dissipation
Rev. 04 — 28 October 2009
6 K/W
6 K/W
6 K/W
R th(c-a)
6 K/W
R th(c-a)
V3 dissipation
V3 dissipation
23 K/W
17 K/W
T
T
T
T
case
amb
case
amb
(heat sink)
(heat sink)
001aad671
other dissipation
other dissipation
LIN fail-safe system basis chip
001aae136
6 K/W
6 K/W
T
T
vj
vj
UJA1069
© NXP B.V. 2009. All rights reserved.
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