SC16C550IN40 NXP Semiconductors, SC16C550IN40 Datasheet - Page 49

• Manufacturer Part Number: SC16C550IN40
• Manufacturer: NXP Semiconductors

Specifications of SC16C550IN40

• Transmit Fifo: 16Byte
• Receive Fifo: 16Byte
• Transmitter And Receiver Fifo Counter: Yes
• Package Type: PDIP
• Operating Supply Voltage (max): 5.5V
• Mounting: Through Hole
• Pin Count: 40
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Number Of Channels: 1
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
9397 750 11619
Product data
12.4 Package related soldering information
Table 28:
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Mounting
Through-hole
mount
Surface mount
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
DBS, DIP, HDIP, SDIP, SIL suitable
BGA, LBGA, LFBGA,
SQFP, SSOP-T
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO,
VSSOP
Rev. 05 — 19 June 2003
[6]
, SO, SOJ
[1]
UART with 16-byte FIFO and IrDA encoder/decoder
[4]
,
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
10 C measured in the atmosphere of the reflow
[3]
[5]
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[6][7]
[8]
SC16C550
Reflow
suitable
suitable
suitable
suitable
suitable
[2]
Dipping
suitable
49 of 52