TDA1597N NXP Semiconductors, TDA1597N Datasheet - Page 19
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TDA1597N
Manufacturer Part Number
TDA1597N
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TDA1597N.pdf
(24 pages)
Specifications of TDA1597N
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Package Type
PDIP
Lead Free Status / RoHS Status
Compliant
Philips Semiconductors
PACKAGE OUTLINES
1997 Feb 27
DIP18: plastic dual in-line package; 18 leads (300 mil)
IF amplifier/demodulator for FM radio receivers
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
SOT102-1
OUTLINE
max.
0.19
4.7
A
L
Z
18
0.020
1
min.
0.51
A
1
max.
0.15
A
3.7
IEC
pin 1 index
2
0.055
0.044
1.40
1.14
b
0.021
0.015
0.53
0.38
b
e
1
JEDEC
D
0.055
0.044
1.40
1.14
b
REFERENCES
2
0
0.013
0.009
0.32
0.23
c
b
scale
EIAJ
21.8
21.4
D
0.86
0.84
19
5
(1)
6.48
6.20
0.26
0.24
10
E
9
b
(1)
1
A
10 mm
b
1
2.54
0.10
2
e
w
A
E
2
M
A
7.62
0.30
e
1
0.15
0.13
3.9
3.4
L
PROJECTION
EUROPEAN
c
8.25
7.80
0.32
0.31
M
E
(e )
M
M
1
H
E
0.37
0.33
Product specification
M
9.5
8.3
H
TDA1597
ISSUE DATE
0.254
0.01
93-10-14
95-01-23
w
SOT102-1
0.033
max.
0.85
Z
(1)