AD9912BCPZ Analog Devices Inc, AD9912BCPZ Datasheet - Page 23

• Manufacturer Part Number: AD9912BCPZ
• Manufacturer: Analog Devices Inc

Specifications of AD9912BCPZ

• Lead Free Status / RoHS Status: Compliant

THERMAL PERFORMANCE
Table 7. Thermal Parameters
Symbol
θ
θ
θ
θ
θ
Ψ
The AD9912 is specified for a case temperature (T
ensure that T
Use the following equation to determine the junction tempera-
ture on the application PCB:
where:
T
T
center of package.
Ψ
PD is the power dissipation (see the Total Power Dissipation
section in the Specifications section).
JA
JMA
JMA
JB
JC
J
CASE
JT
JT
is the junction temperature (°C).
is the value from Table 7.
T
is the case temperature (°C) measured by customer at top
J
= T
CASE
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)
CASE
+ (Ψ
is not exceeded, an airflow source can be used.
JT
× PD)
CASE
). To
Rev. D | Page 23 of 40
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of θ
design considerations.
The values in Table 7 apply to both 64-lead package options.
T
J
= T
A
is the ambient temperature (°C).
JA
A
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the equation
JA
can be used for a first-order
Value
25.2
22.0
19.8
13.9
1.7
0.1
AD9912
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W