MT47H128M16HG-3 IT:A Micron Technology Inc, MT47H128M16HG-3 IT:A Datasheet - Page 19

• Manufacturer Part Number: MT47H128M16HG-3 IT:A
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H128M16HG-3 IT:A

• Organization: 128Mx16
• Address Bus: 17b
• Access Time (max): 4.5ns
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 275mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Seating
11.2 CTR
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball
pads.
plane
0.12
84X Ø0.45
Notes:
0.8 TYP
A
A
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
9 8 7
11.5 ±0.15
0.8 TYP
6.4 CTR
3 2 1
0.8 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
14 ±0.15
19
0.25 MIN
1.2 MAX
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Ball A1 ID
2Gb: x4, x8, x16 DDR2 SDRAM
© 2006 Micron Technology, Inc. All rights reserved.
Packaging