SP000104938ZH Infineon Technologies, SP000104938ZH Datasheet

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SP000104938ZH

Manufacturer Part Number
SP000104938ZH
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of SP000104938ZH

Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Supplier Unconfirmed
Chip Card & Security ICs
SLE 50C363PE for Mobile Communication
36 Kbyte E²PROM
96 Kbyte ROM
4352 bytes RAM
8/16-Bit Security Controller optimized for GSM applications
with enhanced instruction set for large memories
in 0.22 µm CMOS technology
Short Product Information 11.06

Related parts for SP000104938ZH

SP000104938ZH Summary of contents

Page 1

Chip Card & Security ICs SLE 50C363PE for Mobile Communication 36 Kbyte E²PROM 96 Kbyte ROM 4352 bytes RAM 8/16-Bit Security Controller optimized for GSM applications with enhanced instruction set for large memories in 0.22 µm CMOS technology Short Product ...

Page 2

... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...

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Security Controller optimized for Mobile Communication with enhanced instruction set for large memories in 0.22µm CMOS Technology, 96-Kbytes ROM, 4352 bytes RAM, 36-Kbytes E²PROM General Features 8/16-bit microcontroller in 0.22 µm CMOS technology Instructions set compatible with standard 8051 ...

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Memory Security Memory Management and Protection Unit (MMU) with application and user defined segments Addressable memory up to 16-MByte Code execution from XRAM possible 32 bytes security PROM, hardware protected for batch-, wafer-, die-individual security data. Unique chip identification number ...

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Ordering Information 1 Type Package SLE 50C363PE C Die (sawn, unsawn) SLE 50C363PE MXXX MFC5.X (Wire-bonded modules upon request) For ordering information please refer to the databook and contact your sales representative. Pin Description & Module VDD GND CLK SLE ...

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... General Description The SLE50C363PE is a member of the streamlined SLE50PE-series of Infineon Technologies optimized for mobile communications. This security controller is manufactured in advanced 0.22 µm CMOS technology. It has a defined migration path from existing 66P/66PE products with minimized customer effort to migrate the OS and is based on the same tool set. The efficiency of the 8051 instruction set extended by additional powerful instructions together with optimized memory sizes, performance and features compared to existing SLE66CxxxPE derivatives ...

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Memory The SLE50C363PE offers 96-Kbytes of User-ROM, 256 bytes internal RAM, 4096 bytes XRAM and 36-Kbytes MicroSlim E²PROM, to fulfill requirements of GSM applications. The large ROM size allows to place applications in ROM and to keep the E²PROM free ...

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Peripherals The enhanced CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit-CRC) and offers a loadable initialization vector for a better Java support. In order to minimize the overall power consumption, the chip card controller IC ...

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Glossary CLK Clock CRC Cyclic Redundancy Check CPU Central Processing Unit CMOS Complementary Metal-Oxide Semiconductor (technology used to manufacture most of today's chips) E²PROM Electrically Erasable Programmable Read-Only Memory (equivalent to NVM) ESD Electrostatic Discharge, release of static electricity that ...

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