SRF 55V02P Y2.0 Infineon Technologies, SRF 55V02P Y2.0 Datasheet - Page 4

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SRF 55V02P Y2.0

Manufacturer Part Number
SRF 55V02P Y2.0
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of SRF 55V02P Y2.0

Operating Temperature (max)
70C
Pin Count
2
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
Document References
Development Tool Overview
1
Table 1
1)
Short Product Information
Type
SRF 55V02P C
SRF 55V02P MCC8 P-MCC8-2-1
SRF 55V02P Y1.0
SRF 55V02P Y2.0
plastic cards
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
Confidential Data Sheet
Qualification report chip
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
Module specification containing description of package, product logistic etc.
Qualification report module
Inlay specification containing description of package, product logistic etc.
Qualification report inlay
my-d vicinity evaluation and demonstration kit
Ordering and Packaging information
Ordering Information
Package
Die
Inlay 45 x 45 mm
Inlay 45 x 76 mm
1)
2
2
256 bytes
User
4 / 9
Memory
64 bytes
Admin.
Pages
32
Ordering Code
Q67100H4896
on request
Q67100H4909
Q67100H4908
my-d vicinity
SRF 55V02P
2002-07-30

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