NAND32GAH0HZA5E Micron Technology Inc, NAND32GAH0HZA5E Datasheet - Page 5

• Manufacturer Part Number: NAND32GAH0HZA5E
• Manufacturer: Micron Technology Inc

Specifications of NAND32GAH0HZA5E

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

NAND32GAH0H, NAND64GAH0H
List of figures
Figure 1.
Figure 2.
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Figure 5.
Figure 6.
Figure 7.
Device block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
LFBGA169 package connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . 9
Form factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Memory array structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
LFBGA169 12 x 16 x 1.4 mm 132+21+16 3R14 0.50 mm, package outline . . . . . . . . . . . 25
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