MB85R1002PFTNGE1 Fujitsu Components, MB85R1002PFTNGE1 Datasheet - Page 14

• Manufacturer Part Number: MB85R1002PFTNGE1
• Manufacturer: Fujitsu Components
• Type: NVSRAMr

Specifications of MB85R1002PFTNGE1

• Word Size: 16b
• Density: 1Mb
• Interface Type: Parallel
• Access Time (max): 100ns
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Pin Count: 48
• Mounting: Surface Mount
• Supply Current: 15mA
• Lead Free Status / RoHS Status: Compliant

MB85R1002
14
■ PACKAGE DIMENSIONS
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
C
2003-2010 FUJITSU SEMICONDUCTOR LIMITED F48043S-c-2-4
LEAD No.
48-pin plastic TSOP(1)
(FPT-48P-M25)
24
1
48-pin plastic TSOP(1)
(FPT-48P-M25)
INDEX
*
2
14.00±0.20(.551±.008)
12.40±0.10(.488±.004)
0.08(.003)
48
25
"A"
*
0.145
1
12.00±0.10
(.472±.004)
.006
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
+0.05
–0.03
+.002
–.001
Package width ×
Mounting height
Sealing method
package length
Lead shape
(Reference)
Lead pitch
Weight
Details of "A" part
Code
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
(.044±.003)
(.004±.002)
1.13±0.07
0.10±0.05
0.50(.020)
0.22
.009
+0.05
–0.04
+.002
–.002
P-TSOP(1)48-12×12.4-0.50
(Stand off)
(Mounting height)
12.00 × 12.40 mm
0.10(.004)
1.20 mm MAX
(.024±.006)
0.60±0.15
Plastic mold
0 ° ~8 °
0.50 mm
Gullwing
0.37 g
M
DS05-13104-6E
(Continued)