5962-8866208UA QP SEMICONDUCTOR, 5962-8866208UA Datasheet - Page 3

• Manufacturer Part Number: 5962-8866208UA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8866208UA

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
in MIL-PRF-38535, appendix A and herein.
internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements
as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
as specified in table I and shall apply over the full case operating temperature range.
tests for each subgroup are described in table I.
Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
(Copies of these documents are available online at
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
3. REQUIREMENTS
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
2. APPLICABLE DOCUMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.
DEPARTMENT OF DEFENSE SPECIFICATION
DEPARTMENT OF DEFENSE STANDARDS
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
MIL-STD-883
MIL-STD-1835 -
MIL-HDBK-103 -
MIL-HDBK-780 -
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
-
STANDARD
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
http://assist.daps.dla.mil/quicksearch/
SIZE
A
REVISION LEVEL
or
http://assist.daps.dla.mil
D
SHEET
5962-88662
or from
3