HFCT-5962ATG Avago Technologies US Inc., HFCT-5962ATG Datasheet - Page 10

• Manufacturer Part Number: HFCT-5962ATG
• Manufacturer: Avago Technologies US Inc.

Specifications of HFCT-5962ATG

• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155Mbps
• Optical Rise Time: 2ns
• Optical Fall Time: 2ns
• Operating Temperature Classification: Industrial
• Peak Wavelength: 1360/1580nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.5V
• Output Current: 50mA
• Operating Temp Range: -40C to 85C
• Mounting: Snap Fit To Panel
• Pin Count: 20
• Lead Free Status / RoHS Status: Compliant

Figure 8. Recommended Panel Mounting
10
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns is
the control of electromagnetic emissions from electronic
equipment. Success in controlling generated Electro-
magnetic Interference (EMI) enables the designer to pass
a governmental agency’s EMI regulatory standard and
more importantly, it reduces the possibility of interfer-
ence to neighboring equipment. Avago Technologies
has designed the HFCT-5962TL/TG/NL/NG/ATL/ATG to
provide excellent EMI performance. The EMI performance
of a chassis is dependent on physical design and features
which help improve EMI suppression. Avago Technologies
encourages using standard RF suppression practices and
avoiding poorly EMI-sealed enclosures.
(0.4 ±0.004)
10.16 ±0.1
DIMENSIONS IN MILLIMETERS (INCHES)
1.
SFF TRANSCEIVER.
2.
FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG
SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
14.22 ±0.1
±0.004)
(0.56
DETAIL A
15.24
(0.6)
TOP OF
PCB
15.24
(0.6)
B
(0.62 MAX. 0.59 MIN.)
15.75 MAX. 15.0 MIN.
(0.039)
1
A
SECTION B - B
Avago Technologies’ OC-3 LC transceivers (HFCT-5962TL/
TG/NL/NG/ATL/ATG) have nose shields which provide a
convenient chassis connection to the nose of the transceiv-
er. This nose shield improves system EMI performance by
effectively closing off the LC aperture. Localized shielding
is also improved by tying the four metal housing package
grounding tabs to signal ground on the PCB. Though not
obvious by inspection, the nose shield and metal housing
are electrically separated for customers who do not wish to
directly tie chassis and signal grounds together. The recom-
mended transceiver position, PCB layout and panel opening
for these devices are the same, making them mechanically
drop-in compatible. Figure 8 shows the recommended
positioning of the transceivers with respect to the PCB and
faceplate.
SOLDER
POSTS
B