ATA555811-DDW Atmel, ATA555811-DDW Datasheet - Page 38

• Manufacturer Part Number: ATA555811-DDW
• Manufacturer: Atmel

Specifications of ATA555811-DDW

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Not Compliant

10. Ordering Information
Notes:
10.1
10.2
38
ATA5558
1. For available order codes refer to Atmel Sales/Marketing
2. Unique customer ID code programming according to
Delivery Pre-configuration
Ordering Examples (Recommended)
ATA5558 [Preliminary]
parts per year
a b
M c c
The ATA5558 is delivered in a pre-programmed state. The traceability blocks (59-61) contain
unique non erasable traceability data as described in section
remaining memory contains erasable demonstration data which can be replaced by customer
data after having been cleared using a sequence of Select, ArmClear and ClearAll commands.
the demonstration data represents the following device configuration:
Block 63 contains configuration data representing Public Mode, FDX-B Modulation, a data rate
of RF/32, a Tag ID length of 64 bits, preamble value of 7 and a maximum public mode block
value (Maxblock) of 3.
Blocks 0-3 contain an FDX-B encoded animal ID code in accordance with ISO 11784 represent-
ing a National ID code 000123456789 and country code 999.
The Tag ID blocks 56-57 contain a direct copy of the unique traceability data held in blocks
59-60 thus each delivered device will have it’s own 64 bit unique Tag ID code with which anticol-
lision arbitration can be demonstrated.
All other blocks are erased.
ATA555811 - Tested dice on unsawn 6” wafer, thickness 300 µm, no on-chip capacitor, no
- x x x Package
- DDW
- DDT
(-PAE
(-PP
Customer ID
M01
11
12
14
(15
(1)
damping during POR initialization.
(2)
- Dice on wafer, 6” un-sawn wafer, thickness 300 µm
- Dice in Tray (waffle pack), thickness 300 µm
- NOA-2 Micromodule
- Plastic Transponder
- Atmel standard (corresponds to 00 )
- Customer X unique ID code
- 2 pads without on-chip C
- 2 pads with on-chip 80 pF
- 2 pads with on-chip 210 pF
- Micromodule with 330 pF
Figure 2-3 on page 4
(1)
planned)
planned)
planned)
is linked to a minimum order quantity of 1 Mio
“Traceability Data” on page
Drawing
See
See
See
See
See
See
Figure 10-2 on page 40
Figure 10-3 on page 41
Figure 10-1 on page 39
Figure 10-1 on page 39
Figure 10-1 on page 39
Figure 10-1 on page 39
4681C–RFID–09/05
5. The