PCA2002U/10AB/1,00 NXP Semiconductors, PCA2002U/10AB/1,00 Datasheet
PCA2002U/10AB/1,00
Specifications of PCA2002U/10AB/1,00
Related parts for PCA2002U/10AB/1,00
PCA2002U/10AB/1,00 Summary of contents
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PCA2002 32 kHz watch circuit with programmable output period and pulse width Rev. 06 — 6 May 2010 1. General description The PCA2002 is a CMOS integrated circuit for battery operated wrist watches with a 32 kHz quartz crystal as ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name PCA2002U/AB/1 PCA200xU PCA2002U/10AB/1 PCA200xU PCA2002CX8/5/1 PCA200xCX wafer level chip-size package; 5. Block diagram OSCIN OSCOUT Fig 1. PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width Description wire bond die ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning V SS i.c. OSCIN OSCOUT Fig 2. 6.2 Pin description Table 2. Symbol V SS i.c. OSCIN OSCOUT V DD MOT1 MOT2 RESET PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width PCA200xU 1 8 RESET ...
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... NXP Semiconductors 7. Functional description 7.1 Motor pulse The motor driver delivers pulses with an alternating polarity. The output waveform across the motor terminals is illustrated in connected to V The following parameters can be selected and are stored in a One Time Programmable (OTP) memory: • Output periods and 30 s • ...
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... NXP Semiconductors Table 3. Calibration period 1 minute 2 minutes After measuring the effective oscillator frequency, the number of correction pulses must be calculated and stored together with the calibration period in the OTP memory (see Section The oscillator frequency can be measured at pad RESET, where a square wave signal ...
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... NXP Semiconductors Table 5. Bit Inhibit time Calibration period 8 Table 6. Bit Pulse width Output period ( Duty cycle of motor pulse 7 Pulse stretching 8 7.5 Type recognition Byte D is read to determine which type of the PCA200x family is used in a particular application. Table 7. Bit Type recognition PCA2002_6 ...
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... NXP Semiconductors 7.6 Programming procedure To ensure that the oscillator starts up correctly you must execute a reset sequence (see Figure 4). Fig 4. For a watch it is essential that the timing calibration can be made after the watch is fully assembled. In this situation, the supply pins are often the only terminals which are still accessible ...
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... NXP Semiconductors After the V is cleared. The instruction state ends with a second pulse any case, the instruction states are terminated automatically 2 seconds after the last supply modulation pulse. 7.7 Programming the memory cells Applying the two-stage programming pulse (see shift register to the OTP cells. ...
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... NXP Semiconductors 7.8 Checking the memory content The stored data of the OTP array can be checked bit wise by measuring the supply current (see addressed by the shift register. To read a word, the word is first selected (t the shift register ( that it points with each clock pulse to the next bit. ...
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... NXP Semiconductors 7.9 Frequency tuning at assembled watch Figure 7 Fig 7. 7.10 Measurement of the oscillator frequency and the inhibition time The output of the two measuring states can either be monitored directly at pin RESET modulation of the supply current (a modulating resistor of 30 kΩ is connected between V The supply voltage modulation must be followed as shown in guarantee the correct start-up of the circuit during production and testing ...
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... NXP Semiconductors Fig 9. PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width p(start) V P(prog)(start) V DD(nom nominal supply voltage. DD(nom) Supply voltage modulation for start and stop of instruction state 2 All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 8. Limiting values Table 8. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter ESD stg T amb [1] When writing to the OTP cells, the supply voltage (V period [2] Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows which rapidly discharges the battery ...
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... NXP Semiconductors 9. Characteristics Table 9. Characteristics 32.768 kHz osc otherwise specified. Symbol Parameter Supplies V supply voltage DD ΔV supply voltage variation DD I supply current DD Motor output V saturation voltage sat Z output impedance (short o(sc) circuit) Oscillator V start voltage start g transconductance m t start-up time startup Δ ...
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... NXP Semiconductors 10. OTP programming characteristics Table 10. Specifications for OTP programming [1] Symbol Parameter V supply voltage DD V programming supply voltage (start) P(prog)(start) V programming supply voltage (stop) P(prog)(stop) V supply voltage modulation P(mod) V prestore voltage prestore V supply voltage store I store current store t start pulse width ...
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... NXP Semiconductors 11. Bare die outline Wire bond die; 8 bonding pads; 1.16 x 0.86 x 0.22 mm DIMENSIONS (mm are the original dimensions) UNIT max 0.22 mm nom 0.20 1.16 0.86 min 0.18 OUTLINE VERSION IEC PCA200xU Fig 10. Bare die outline PCA200xU PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width ...
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... NXP Semiconductors WLCSP8: wafer level chip-size package; 8 bumps; 1.16 x 0. DIMENSIONS (mm are the original dimensions) UNIT max 0.310 0.090 0.22 mm nom 0.275 0.075 0.20 min 0.240 0.060 0.18 OUTLINE VERSION IEC PCA200xCX Fig 11. Bare die outline PCA200xCX (WLCSP8) Table 11. ...
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... NXP Semiconductors 12. Packing information 12.1 Tray information Fig 12. Tray details Table 12. Dimension PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width 1,1 2,1 1,2 2,2 1,3 F 1,y A Tray dimensions Description pocket pitch; x direction pocket pitch; y direction pocket width ...
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... NXP Semiconductors Fig 13. Tray alignment PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width The orientation of the pocket is indicated by the position of the IC type name on the surface of the die, with respect to the cut corner on the upper left of the tray. ...
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... NXP Semiconductors 12.2 Unsawn wafer information Fig 14. Wafer layout of PCA2002CX8 PCA2002_6 Product data sheet 32 kHz watch circuit with programmable output period and pulse width ~18 μm (1) 84 μm 84 μm Saw lane detail Straight edge of the wafer The die are grouped in arrays of 2 × 6 devices. Each array is edged with a metal path. All this metal paths have to be cut while dicing ...
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... NXP Semiconductors 13. Soldering of WLCSP packages 13.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount reflow soldering description” ...
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... NXP Semiconductors Fig 15. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 13.3.1 Stand off The stand off between the substrate and the chip is determined by: • The amount of printed solder on the substrate • ...
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... NXP Semiconductors Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon ...
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... Document ID Release date PCA2002_6 20100506 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added specifying amendments to PCA2002_5 20081111 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers. NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7.1 Motor pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Time calibration . . . . . . . . . . . . . . . . . . . . . . . . 4 7.3 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 Programming possibilities 7.5 Type recognition . . . . . . . . . . . . . . . . . . . . . . . . 6 7 ...