LH7A404N0F000B1A,5 NXP Semiconductors, LH7A404N0F000B1A,5 Datasheet - Page 70

• Manufacturer Part Number: LH7A404N0F000B1A,5
• Manufacturer: NXP Semiconductors

Specifications of LH7A404N0F000B1A,5

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.71V
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.89V
• Package Type: LFBGA
• Pin Count: 324
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

LH7A404
PACKAGE SPECIFICATIONS
70
LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1021-1
OUTLINE
VERSION
max
1.7
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
Y
V
T
P
K
H
F
D
B
1.35
1.15
A
W
U
R
N
L
G
E
C
A
J
2
IEC
1
2
0.5
0.4
b
3
Figure 55. Package outline SOT1021-1 (LFBGA324)
4
5
17.1
16.9
D
e
6
7
8
17.1
16.9
9
JEDEC
E
10
e
D
11
1
12
REFERENCES
0.8
13
e
1/2 e
14
15
NXP Semiconductors
0
15.2
16
e
1
17
18
b
19
15.2
JEITA
e 2
20
scale
5
0.15
1/2 e
v
B
e
∅ w
∅ v
e
A
E
0.08
2
w
M
M
10 mm
C
C
0.12
A
y
B
A
0.1
y
1
A
2
y
1
A
PROJECTION
1
EUROPEAN
C
detail X
32-Bit System-on-Chip
C
X
Product data sheet
y
ISSUE DATE
07-07-07
07-07-07
SOT1021-1