MC9S08SH16CTL Freescale, MC9S08SH16CTL Datasheet - Page 315

• Manufacturer Part Number: MC9S08SH16CTL
• Manufacturer: Freescale

Specifications of MC9S08SH16CTL

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 1KB
• # I/os (max): 23
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 16-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: TSSOP
• Program Memory Type: Flash
• Program Memory Size: 16KB
• Lead Free Status / RoHS Status: Compliant

Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08SH32 and MC9S08SH16 devices.
B.1.1
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Freescale Semiconductor
Jennifer
1
2
See
See
Device Number
MC9S08SH32
MC9S08SH16
Core
Family
- SH
Status
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Table
Table B-2
Ordering Information
Device Numbering Scheme
1-1for a complete description of modules included on each device.
for package information.
1
Figure B-1. MC9S08SH32 Device Numbering Scheme
Flash
32 K
16
MC 9
Table B-1. Device Numbering System
Memory
MC9S08SH32 Series Data Sheet, Rev. 2
S08 SH n
1024 B
1024 B
RAM
Memory Size
- 32 Kbytes
- 16 Kbytes
PRELIMINARY
28 TSSOP
28 SOIC
C
28-Pin
xx
R
Available Packages
20 TSSOP
20-Pin
Tape and Reel Suffix (optiona
- R = Tape and Reel
Package Designator
Two letter descriptor (refer to
Table
Temperature Option
- C = –40 to 85 °C
- M = –40 to 125 °C
B-2).
2
16 TSSOP
16-Pin
315