TCD1305DG Toshiba, TCD1305DG Datasheet
TCD1305DG
Specifications of TCD1305DG
Related parts for TCD1305DG
TCD1305DG Summary of contents
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... TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) Preliminary The TCD1305DG is a high sensitive and low dark current 3648−elements linear image sensor. The sensor can be used for POS handscanner. The device is consist of sensitivity CCD chip. The TCD1305DG has electronic shutter function (ICG). Electronic shutter function can keep always output voltage constant that vary with the intensity of lights ...
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... CIRCUIT DIAGRAM PIN NAMES M Master Clock φ SH Shift Gate ICG Integration Clear Gate V Power (Analog Power (Digital Ground NC Non Connection 2 TCD1305DG 2004-01-06 ...
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... RI V SAT V MDK TTE VLAGICG ∆ χ × 100 % χ ∆ χ is the maximum deviation from + × 100 % χ is average of total signal outputs. 3 TCD1305DG MIN. TYP. MAX. UNIT 44.8 64 ― lx·s ― ― ― ― 1.2 1.6 ― V ― ― % ― ...
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... V SAT Note 6: Definition DR= V MDK V is proportional to t MDK INT So the shorter t condition makes wider DR value. INT V SAT Note 7: Definition SE= R Note 8: DC signal output voltage is defined as follows: (Integration time · 4 TCD1305DG 2004-01-06 ...
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... Shift Pulse Capacitance ICG Pulse Capacitance SYMBOL “H” Level “L” Level “H” Level “L” Level “H” Level “L” Level DD −0.5V DD (Ta=25°C) SYMBOL f 5 TCD1305DG MIN. TYP. MAX. 4.5 5.0 5.5 V φ 0.44 4.5 5.0 5.5 V ...
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... If you use electronic shutter function. t USE ELECTRONIC SHUTTER Pulse Timing of SH and ICG • SH cycle=Tint t (MIN.)=10µs INT You have always same SH pulse width (t3). SYMBOL (MIN.)=10µs INT 8 TCD1305DG MIN. TYP. MAX. UNIT 1000 5000 ― ns 100 500 1000 ns 1000 ― ― ns ...
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... TYPICAL PERFOMANCE CURVES 9 TCD1305DG 2004-01-06 ...
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... TYPICAL PERFOMANCE CURVES 10 TCD1305DG 2004-01-06 ...
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... TYPICAL DRIVE CIRCUIT TCD1305DG 11 TCD1305DG 2004-01-06 ...
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... Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures 260°C, or within three seconds for lead temperatures 350°C. 12 TCD1305DG 2004-01-06 ...
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... PACKAGE DIMENSIONS Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n=1.5) Weight : (3.5g (Typ.)) 13 TCD1305DG Unit : mm 2004-01-06 ...
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... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. 14 TCD1305DG 000707EBA 2004-01-06 ...