UPD3747D Renesas Electronics America, UPD3747D Datasheet - Page 19

• Manufacturer Part Number: UPD3747D
• Manufacturer: Renesas Electronics America

Specifications of UPD3747D

• Lead Free Status / RoHS Status: Supplier Unconfirmed

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RECOMMENDED SOLDERING CONDITIONS
consult with our sales offices.
Type of Through-hole Device
Cautions 1.
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
μ
Partial heating method
PD3747D-A : CCD linear image sensor 22-pin ceramic DIP (CERDIP) (10.16 mm (400))
2.
Process
During assembly care should be taken to prevent solder or flux from contacting the glass cap.
The optical characteristics could be degraded by such contact.
Soldering by the solder flow method may have deleterious effects on prevention of glass cap
soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature : 380°C or below, Heat time : 3 seconds or less (per pin)
Data Sheet S14892EJ4V0DS
Conditions
μ
PD3747
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