UPD16510GR8JGE1 Renesas Electronics America, UPD16510GR8JGE1 Datasheet - Page 13

• Manufacturer Part Number: UPD16510GR8JGE1
• Manufacturer: Renesas Electronics America

Specifications of UPD16510GR8JGE1

• Lead Free Status / RoHS Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
(C10535E).
Surface mount device
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
PD16510GR-8JG: 20-pin plastic shrink SOP (225 mil)
Infrared ray reflow
VPS
Wave soldering
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Process
device will be damaged by heat stress.
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 3 times.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 3 times.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Conditions
IR35-00-3
VP15-00-3
WS60-00-1
PD16510
Symbol
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