935273316118 NXP Semiconductors, 935273316118 Datasheet - Page 25

• Manufacturer Part Number: 935273316118
• Manufacturer: NXP Semiconductors

Specifications of 935273316118

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: TSSOP
• Pin Count: 16
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
PCA9541_7
Product data sheet
10.2 High reliability systems
In a typical multipoint application, shown in
primary and back-up) are located on separate I
downstream I
to provide high reliability of the I
I
command of the I
the other master is disabled or removed from the system. The failed master is isolated
from the system and will not affect communication between the on-line master and the
slave devices located on the cards.
For even higher reliability in multipoint backplane applications, two dedicated masters can
be used for every card as shown in
2
Fig 18. High reliability backplane application
Fig 19. Very high reliability backplane application
C-bus commands are sent via the primary or back-up master and either master can take
2
C-bus slave cards/devices via a PCA9541/01 for non-hot swap applications
SCL0
SDA0
2
C-bus. Either master at any time can gain control of the slave devices if
SCL0
SDA0
SCL0
SDA0
SCL0
SDA0
SCL0
SDA0
Rev. 07 — 2 July 2009
2-to-1 I
2
C-bus.
2
C-bus master selector with interrupt logic and reset
Figure
19.
Figure
2
C-buses that connect to multiple
18, the two masters (for example,
SCL1
SDA1
SCL1
SDA1
SCL1
SDA1
SCL1
SDA1
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SDA1
SCL1
PCA9541
© NXP B.V. 2009. All rights reserved.
002aab612
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