BAP64-02 NXP Semiconductors, BAP64-02 Datasheet - Page 3

Planar PIN diode in a SOD523 ultra small plastic SMD package

BAP64-02

Manufacturer Part Number
BAP64-02
Description
Planar PIN diode in a SOD523 ultra small plastic SMD package
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of BAP64-02

Configuration
Single
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
715mW
Operating Temperature Classification
Military
Reverse Voltage
175V
Package Type
I-IGIA
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.35@100mAOhm
Typical Carrier Life Time
1.55us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Applications Frequency Range
SHF
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP64-02
Manufacturer:
NXP
Quantity:
30 000
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
V
I
C
r
L
R
j
R
D
L
S
= 25 C unless otherwise specified.
F
Silicon PIN diode
d
th j-s
SYMBOL
SYMBOL
forward voltage
reverse leakage current
diode capacitance
diode forward resistance
charge carrier life time
series inductance
thermal resistance from junction to soldering point
PARAMETER
PARAMETER
Rev. 06 - 9 January 2008
I
V
V
V
V
V
f = 100 MHz; note 1
when switched from I
I
measured at I
F
R
R
R
R
R
R
I
I
I
I
= 50 mA
= 6 mA; R
F
F
F
F
=175 V
= 20 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 20 V; f = 1 MHz
= 0.5 mA
= 1 mA
= 10 mA
= 100 mA
CONDITIONS
L
R
= 100 ;
= 3 mA
F
= 10 mA to
0.95
0.48
0.35
0.23
20
10
2
0.7
1.55
0.6
TYP.
VALUE
Product specification
85
BAP64-02
1.1
10
1
0.35
40
20
3.8
1.35
MAX.
3 of 7
UNIT
K/W
V
pF
pF
pF
nH
UNIT
A
A
s

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