BAP64-02 NXP Semiconductors, BAP64-02 Datasheet - Page 5

Planar PIN diode in a SOD523 ultra small plastic SMD package

BAP64-02

Manufacturer Part Number
BAP64-02
Description
Planar PIN diode in a SOD523 ultra small plastic SMD package
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of BAP64-02

Configuration
Single
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
715mW
Operating Temperature Classification
Military
Reverse Voltage
175V
Package Type
I-IGIA
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.35@100mAOhm
Typical Carrier Life Time
1.55us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Applications Frequency Range
SHF
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP64-02
Manufacturer:
NXP
Quantity:
30 000
NXP Semiconductors
PACKAGE OUTLINE
Plastic surface-mounted package; 2 leads
Silicon PIN diode
OUTLINE
VERSION
SOD523
A
E
b p
c
1
(1)
IEC
H E
D
JEDEC
2
REFERENCES
A
Rev. 06 - 9 January 2008
v
M
SC-79
JEITA
A
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode.
UNIT
mm
0.65
0.58
A
0.34
0.26
b p
0
0.17
0.11
PROJECTION
EUROPEAN
c
scale
0.5
1.25
1.15
D
1 mm
0.85
0.75
Product specification
E
BAP64-02
ISSUE DATE
02-12-13
06-03-16
1.65
1.55
H E
SOD523
5 of 7
0.1
v

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