BAP50-03 NXP Semiconductors, BAP50-03 Datasheet - Page 4
![General purpose PIN diode in a SOD323 small plastic SMD package](/photos/31/41/314173/sod323_sml.jpg)
BAP50-03
Manufacturer Part Number
BAP50-03
Description
General purpose PIN diode in a SOD323 small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet
1.BAP50-03.pdf
(7 pages)
Specifications of BAP50-03
Configuration
Single
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
500mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
SOD-323
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
5@10mAOhm
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BAP50-03
Manufacturer:
power interigration
Quantity:
100
Company:
Part Number:
BAP50-03
Manufacturer:
ON
Quantity:
3 000
Part Number:
BAP50-03
Manufacturer:
KF 科范微
Quantity:
20 000
Part Number:
BAP50-03,115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
7. Package outline
Fig 5.
BAP50-03_4
Product data sheet
Plastic surface-mounted package; 2 leads
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode
UNIT
mm
VERSION
OUTLINE
SOD323
Package outline SOD323
1.1
0.8
A
max
0.05
A
1
1
0.40
0.25
b
p
IEC
0.25
0.10
(1)
c
1.8
1.6
D
H
D
D
1.35
1.15
JEDEC
E
REFERENCES
0
H
2.7
2.3
Rev. 04 — 11 September 2009
D
0.45
0.15
2
L
A
p
0.25
0.15
JEITA
SC-76
Q
scale
b
X
v
p
1
M
0.2
v
A
A
2 mm
A
1
detail X
PROJECTION
EUROPEAN
General purpose PIN diode
E
L
BAP50-03
p
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
Q
c
03-12-17
06-03-16
SOD323
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