BAP50-03 NXP Semiconductors, BAP50-03 Datasheet - Page 5

General purpose PIN diode in a SOD323 small plastic SMD package

BAP50-03

Manufacturer Part Number
BAP50-03
Description
General purpose PIN diode in a SOD323 small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-03

Configuration
Single
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
500mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
SOD-323
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
5@10mAOhm
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Compliant

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NXP Semiconductors
8. Abbreviations
9. Revision history
Table 7.
BAP50-03_4
Document ID
BAP50-03_4
Modifications:
BAP50-03_3
BAP50-03_2
BAP50-03_N_1
Product data sheet
Revision history
Table 6.
Acronym
AQL
PIN
SMD
RF
S4
Release date
20090911
20040211
19990510
19990201
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Abbreviations
Description
Acceptable Quality Level
P-type, Intrinsic, N-type
Surface Mounted Device
Radio Frequency
Special inspection level 4
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Preliminary data sheet
Rev. 04 — 11 September 2009
Change notice
-
General purpose PIN diode
BAP50-03
Supersedes
BAP50-03_3
BAP50-03_2
BAP50-03_N_1
-
© NXP B.V. 2009. All rights reserved.
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