UJA1069TW24/3V0 NXP Semiconductors, UJA1069TW24/3V0 Datasheet - Page 58
UJA1069TW24/3V0
Manufacturer Part Number
UJA1069TW24/3V0
Description
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1069TW243V0.pdf
(64 pages)
Specifications of UJA1069TW24/3V0
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
24
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
12. Package outline
Fig 27. Package outline SOT549-1 (HTSSOP32)
UJA1069_4
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 04 — 28 October 2009
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
LIN fail-safe system basis chip
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
L
0.1
p
w
UJA1069
© NXP B.V. 2009. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
58 of 64
o
A
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