MT47H128M16HG-37E:A Micron Technology Inc, MT47H128M16HG-37E:A Datasheet - Page 21
MT47H128M16HG-37E:A
Manufacturer Part Number
MT47H128M16HG-37E:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H128M16HG-37EA.pdf
(134 pages)
Specifications of MT47H128M16HG-37E:A
Organization
128Mx16
Address Bus
17b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
195mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
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Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
Seating
60X Ø0.45
plane
0.12 A
8 CTR
0.8 TYP
A
Notes:
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
0.8 TYP
11.5 ±0.15
6.4 CTR
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.1
21
Ball A1 ID
14 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.
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