OQ2535HP NXP Semiconductors, OQ2535HP Datasheet - Page 8

• Manufacturer Part Number: OQ2535HP
• Manufacturer: NXP Semiconductors

Specifications of OQ2535HP

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Pin Count: 100
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Supplier Unconfirmed

Philips Semiconductors
ESD protection
All pads are protected by ESD protection diodes with the
exception of the high frequency outputs DOUT, DOUTQ,
DLOOP, DLOOPQ, COUT, COUTQ, CLOOP and
CLOOPQ and clock inputs CIN and CINQ.
Cooling
In many cases it is necessary to mount a special cooling
device on the package. The thermal resistance from
junction to case, R
are given in Chapter “Thermal characteristics”. Since the
heat-slug in the package is connected to the die, the
cooling device should be electrically isolated.
To calculate if a heatsink is necessary, the maximum
allowed total thermal resistance R
where:
As long as R
including environmental conditions such as air flow and
board layout, no heatsink is necessary.
For example if T
P
which is more than the worst case R
heatsink is necessary.
Another example; if for safety reasons T
low as 110 C, while T
In this case extra cooling is needed. The thermal
resistance of the heatsink is calculated as follows:
Table 1 BST identifier code
Note
1. LSB is shifted out first on the TDO pin.
1999 Oct 04
R
R
R
tot
th
R
the application
T
T
th
th
SDH/SONET STM16/OC48 multiplexer
VERSION
j
amb
th
= 1.65 W, then:
=
= junction temperature
=
=
= total thermal resistance from junction to ambient in
0001
T
----------------------- -
-------------------------- -
-------------------------- -
= ambient temperature.
120 55
110 85
j
–
P
1.65
2.0
T
tot
amb
th
–
–
is greater than R
j
= 120 C, T
th j-c
=
=
39.4 K/W
12.5 K/W
and from junction to ambient, R
OQ
amb
01
= 85 C and P
amb
th j-a
= 55 C and
th
is calculated as:
of the OQ2536HP
th j-a
00 1001 1110 0111
j
tot
= 33 K/W, so no
should stay as
2535 (BINARY)
= 2 W, then:
th j-a
(1)
(2)
(3)
,
8
where:
If for instance R
Built in temperature sensor
Three series-connected diodes have been integrated for
measuring junction temperature. The diode array,
accessed by means of the DIOA (anode) and DIOC
(cathode) pins, has a temperature dependency of
approximately 6 mV/ C. With a diode current of 1 mA, the
voltage will be somewhere in the range of 1.7 to 2.5 V,
depending on temperature.
Boundary Scan Test (BST) interface
Boundary scan test logic has been implemented for all
digital inputs and outputs on the low frequency interface, in
accordance with “IEEE Std 1149.1-1990” . All scan tests
other than SAMPLE mode are available. The boundary
scan test logic consists of a TAP controller, a BYPASS
register, a 2-bit instruction register, a 32-bit identification
register and a 36-bit boundary scan register (the last two
are combined). The architecture of the TAP controller and
the BYPASS register is in accordance with IEEE
recommendations. The four command modes, selected by
means of the instruction register, are: EXTEST (00),
PRELOAD (01), IDCODE (10) and BYPASS (11). All
boundary scan test inputs, TDI, TMS, TCK and TRST,
have internal pull-up resistors. The maximum test clock
frequency at TCK is 12 MHz.
R
R
R
R
R
see Chapter “Thermal characteristics”.
th h-a
th h-a
th h-a
th c-h
th j-c
= thermal resistance from junction to case,
= thermal resistance from case to heatsink
= thermal resistance from heatsink to ambient
17.0 K/W
PHILIPS SEMICONDUCTORS
---------- -
12.5
------- -
R
1
1
th
–
–
th c-h
------------- -
R
----- -
33
0000 0010 101
1
th j-a
1
= 0.5 K/W and R
–
1
–
–
1
3.1
–
R
th j-c
–
R
Product specification
th c-h
th j-a
OQ2535HP
= 33 K/W then:
LSB
1
(1)
(4)
(5)