PCA9306D.112 NXP Semiconductors, PCA9306D.112 Datasheet - Page 22

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PCA9306D.112

Manufacturer Part Number
PCA9306D.112
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA9306D.112

Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Package Type
SO
Pin Count
8
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
14. Abbreviations
PCA9306
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 13.
Acronym
CDM
ESD
GTL
HBM
I
I/O
LVTTL
MM
PLL
PRR
RC
SMBus
2
Fig 20. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Charged-Device Model
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Inter-Integrated Circuit bus
Input/Output
Low Voltage Transistor-Transistor Logic
Machine Model
Phase-Locked Loop
Pulse Repetition Rate
Resistor-Capacitor network
System Management Bus
Rev. 6 — 25 November 2010
Dual bidirectional I
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
2
C-bus and SMBus voltage-level translator
temperature
peak
PCA9306
© NXP B.V. 2010. All rights reserved.
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